An Oxygen-Insensitive Degradable Resist for Fabricating Metallic Patterns on Highly Curved Surfaces by Uv-Nanoimprint Lithography

Xin Hu,Shisong Huang,Ronghua Gu,Changsheng Yuan,Haixiong Ge,Yanfeng Chen
DOI: https://doi.org/10.1002/marc.201400251
IF: 5.006
2014-01-01
Macromolecular Rapid Communications
Abstract:In this paper, an oxygen-insensitive degradable resist for UV-nanoimprint is designed, comprising a polycyclic degradable acrylate monomer, 2,10-diacryloyloxymethyl-1,4,9,12-tetraoxaspiro [4.2.4.2] tetradecane (DAMTT), and a multifunctional thiol monomer pentaerythritol tetra(3-mercaptopropionate) (PETMP). The resist can be quickly UV-cured in the air atmosphere and achieve a high monomer conversion of over 98%, which greatly reduce the adhesion force between the resist and the soft mold. High conversion, in company with an adequate Young's modulus (about 1 GPa) and an extremely low shrinkage (1.34%), promises high nanoimprint resolution of sub-50 nm. The cross-linked resist is able to break into linear molecules in a hot acid solvent. As a result, metallic patterns are fabricated on highly curved surfaces via the lift off process without the assistance of a thermoplastic polymer layer.
What problem does this paper attempt to address?