Abstract:Inspired by the water transport in plants, a wetting‐induced assembly method based on the differential capillary effect for liquid metal ink (D‐LMWA) is proposed, achieving high‐precision monolayer circuits (4 μm) and multilayer circuits (5 μm), to overcome the difficulties of breakpoints and surface residues. And the transparent shielding conductor with high stretchability and the multilayer touch sensor are achieved. Manipulating liquid metal inks to create conductive microstructures has attracted widespread interest as liquid metal microstructures are turning into influential components in flexible electronics. However, it is challenging to prevent the issues with low precision, low efficiency, and residue caused by sedimentation, free diffusion, and the Marangoni effect. Inspired by the water transport in plants, the wetting‐induced assembly method based on the differential capillary effect for liquid metal ink is created to realize the facile and rapid manufacture of liquid metal conductive microstructures. The single‐micron accuracy circuits with a minimum of ≈4 μm straight lines are fabricated to a centimeter scale. This method can also be extended to the preparation of multilayer circuits (minimum 5 μm through hole). The resulting entirely flexible stretchable circuits make it possible to construct highly stretchable devices, such as flexible transparent conductors and stretching sensors. Transparent conductors exhibit excellent mechanical (maximum ≈750% tensile rupture limit) and optoelectronic properties (the transmittance reaches ≈87% and the sheet resistance is ≈0.5 Ω/□)|making them suitable for optically‐clear electromagnetic shielding. This study offers a fresh and plain approach to solving the assembly problem of liquid metal inks, paving the way for the creation of flexible electronic devices

Fabricating High-Resolution Metal Pattern with Inkjet Printed Water-Soluble Sacrificial Layer

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Fabrication of Patterned Metal Films on Organic Substrates by Transfer Printing

Patternable, High-Precision, Controllable Wettability Copper Layers for 3D Resin-Based Weather-Resistant Electronics and 3D Liquid Manipulation

Ultra High Resolution, Low Temperature, Direct Metal Patterning by Selective Laser Processing of Solution Deposited Metal Nanoparticles

A Sacrificial Layer Strategy for Photolithography on Highly Hydrophobic Surface and Its Application for Electrowetting Devices.

Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits

Polydimethylsiloxane-Assisted Catalytic Printing for Highly Conductive, Adhesive, and Precise Metal Patterns Enabled on Paper and Textiles.

All-inkjet-printed Flexible Electronics Fabrication on a Polymer Substrate by Low-Temperature High-Resolution Selective Laser Sintering of Metal Nanoparticles

Direct Fabrication Of High-Resolution And High-Performance Flexible Electronics Via Surface-Activation-Localized Electroless Plating

Fabricating Metallic Circuit Patterns on Polymer Substrates Through Laser and Selective Metallization.

Transfer Printing Via a PAA Sacrificial Layer for Wrinkle-Free PDMS Metallization

Pressured liquid metal screen printing for rapid manufacture of high resolution electronic patterns

Fabrication of copper patterns on flexible substrate by patterning-adsorption-plating process.

Fabrication of High-Resolution Flexible Circuits and Sensors Based on Liquid Metal Inks by Spraying and Wiping Processing.

Patterned deposition of metal-organic frameworks onto plastic, paper, and textile substrates by inkjet printing of a precursor solution.

Atomized Spraying of Liquid Metal Droplets on Desired Substrate Surfaces as a Generalized Way for Ubiquitous Printed Electronics

Custom Writing Catalytic Tracks for Selective Pattern Metallization on Flexible Substrate

Formation of low surface energy separators with undercut structures via a full-solution process and its application in inkjet printed matrix of polymer light-emitting diodes

Patterned Metal Deposition on Si Based on Self-Assembly and Inkjet Printing