Patternable, High-Precision, Controllable Wettability Copper Layers for 3D Resin-Based Weather-Resistant Electronics and 3D Liquid Manipulation

Pengan Luo,Haoran Xu,Hao Lu,Huaiyu Zhao,Siying Li,Tao Zhou

DOI: https://doi.org/10.1039/d4mh00756e

IF: 13.3

2024-11-02

Materials Horizons

Abstract:The realization of 3D patterned metal layers with manipulable surface wettability has significant potential, especially in integrating microelectronics with weather resistance and multifunctional liquid manipulation. However, developing a facile and efficient method to bring it to fruition remains a great challenge. In this work, we proposed a novel 3D selective metallization strategy that combines stereolithography 3D printing with laser-induced selective metallization (LISM). Utilizing 355 nm UV or 1064 nm lasers, this strategy can prepare 3D conductive copper patterns (or circuits) with controlled wettability on various 3D-printed resin parts. The copper layer surface prepared by LISM formed microstructures similar to the papillae on the surface of a lotus leaf, and it spontaneously owned superhydrophobicity (156.6°) after aging in the air at room temperature. The superhydrophobic 3D circuits with self-cleaning, corrosion-resistant, and anti-condensation performance were successfully fabricated. By further treating the copper layer with a 355 nm UV laser, we realized the transformation of the superhydrophobic copper layer to a superhydrophilic state, enabling us to prepare high-precision superhydrophilic patterns or channels. A 3D self-driven flow channel was fabricated to successfully realize 3D liquid manipulation and small-scale chemical experiments.

materials science, multidisciplinary,chemistry