Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

Liexin Wu,Li Meng,Yueyue Wang,Ming Lv,Taoyuan Ouyang,Yilin Wang,Xiaoyan Zeng

DOI: https://doi.org/10.1088/2631-7990/acd826

2023-05-24

International Journal of Extreme Manufacturing

Abstract:Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits meeting the requirements of high service temperature, high-conductivity and fine-resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from -55 oC to 125 oC for more than 100 cycles. Particularly, the covering of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 μm and 100 μm were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated.

engineering, manufacturing,materials science, multidisciplinary