Abstract:Direct manufacturing of customized end-use electronic products is becoming an emerging trend of additive manufacturing (AM). This highly demands the evolution of the conventional AM processes from simply building single-material parts to simultaneously delivering complex structures and end-use functionalities. In this work, we propose a novel hybrid additive manufacturing solution that combines stereolithography (SLA) three-dimensional (3D) printing and laser-activated electroless plating for the manufacture of 3D fully functional electronic products. With our newly developed functional SLA resin that can be 3D printed, laser-activated, and thereafter selectively metalized, high-resolution circuitry can be free-formly patterned on 3D structures. In virtue of high-performance electrical materials, this technology is capable of creating not only 3D direct-current (DC) electronics but also 3D high-frequency devices like microwave/millimeter-wave antennas, which cannot be fabricated via traditional printed circuit board (PCB) technology and not even by most AM processes. This study represents a significant advance in additive manufacturing technologies, and more importantly offers a unique opportunity for the mass customization of fully functional 3D electronic products, which shows great potentials in consumer electronics, communication engineering, and automobile and aerospace industries.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01199?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01199</a>.Double-side 3D LED blinking circuit (Movie S1) (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_001.mp4">MP4</a>)Customized keychain with a non-contact electroprobe (Movie S2) (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_002.mp4">MP4</a>)Settling of catalyst particles in the resin matrix; the explanation for spherical morphology of the copper-plated surface; circuit diagrams of DC applications; the geometry values of microwave antennas in this work; and sample preparation and permittivity measurements of resins (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_003.pdf">PDF</a>)This article has not yet been cited by other publications.

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