Abstract:The Ni‐PTFE mold is a nanocomposite mold fabricated by one‐pot electroforming using anodic aluminum oxide (AAO) foil as a template. It has low surface energy and low surface wettability, enabling precise, defect‐free nanopatterns down to 100 nm over 20 cycles of thermal nanoimprinting (T‐NIL). UV‐NIL also succeeded, with the nanocomposite mold exhibiting superior demolding compared to a silane‐coated Ni mold. Nanoimprinting large‐area structures, especially high‐density features like meta lenses, poses challenges in achieving defect‐free nanopatterns. Conventional high‐resolution molds for nanoimprinting are often expensive, typically constructed from inorganic materials such as silicon, nickel (Ni), or quartz. Unfortunately, replicated nanostructures frequently suffer from breakage or a lack of definition during demolding due to the high adhesion and friction at the polymer‐mold interface. Moreover, mold degradation after a limited number of imprinting cycles, attributed to contamination and damaged features, is a common issue. In this study, a disruptive approach is presented to address these challenges by successfully developing an anti‐sticking nanocomposite mold. This nanocomposite mold is created through the co‐deposition of nickel atoms and low surface tension polytetrafluoroethylene (PTFE) nanoparticles via electroforming. The incorporation of PTFE enhances the ease of polymer release from the mold. The resulting Ni‐PTFE nanocomposite mold exhibits exceptional lubrication properties and a significantly reduced surface energy. This robust nanocomposite mold proves effective in imprinting fine, densely packed nanostructures down to 100 nm using thermal nanoimprinting for at least 20 cycles. Additionally, UV nanoimprint lithography (UV‐NIL) is successfully performed with this nanocomposite mold. This work introduces a novel and cost‐effective approach to reusable high‐resolution molds, ensuring defect‐reduction production in nanoimprinting.

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