Angle Effect of Ultrasonic Agitation on the Development of Thick JSR THB-430N Negative UV Photoresist

F.-G. Tseng,C.-S. Yu
DOI: https://doi.org/10.1007/s00542-002-0177-7
2002-01-01
Microsystem Technologies
Abstract:A novel method by using adjusted ultrasonic agitation to improve the developing depth, developing time, surface roughness, and undercut problem of thick JSR-430N negative UV photoresist is proposed. This method has been successfully employed to fabricate ultra-thick microstructures of thickness more than 1.4 mm and aspect ratio at least of 5 by JSR THB-430N negative UV photoresist. With the improved ultrasonic developing procedure, the resist can potentially be a replacement of SU-8 resist for the application of high aspect ratio plating mold, due to its good stripping property [1]. The power and angle of ultrasonic agitation have also been studied and characterized. The development of thick JSR-430N resist under different ultrasonic agitation angles has been verified to have different effects on developing time, resist sidewall profile, and surface roughness.
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