Application of Ultrasonic Stress Relief Technology to Microinjection Mold Fabrication
DU Li-qun,LI Cheng-bin,LI Yong-hui,YU Tong-min
DOI: https://doi.org/10.3788/ope.20122006.1250
2012-01-01
Abstract:In the UV-LIGA fabrication process of a microinjection metal mold,the large internal stress of a SU-8 layer can result in SU-8 mould defects such as micro cracks,distortion or even exfoliation.In order to avoid these defects,the ultrasonic stress relief technology was introduced into the microinjection process.First,the SU-8 mould was obtained by coating,soft baking,ultraviolet exposure and post-exposure baking,and it was treated by the ultrasonic stress relief equipment before developing.Then the backless plate growing method was adopted to directly fabricate the nickel micro-electroforming pattern on a 38CrNiMnMo mould steel substrate and the SU-8 layer defects emerged in the process such as the distortion and exfoliation in the SU-8 spin coating on a non-circular substrate,the air bubbles in photoresist layer and the adhesion of plating layer with the substrate were eliminated or improved.Finally,the microinjection mold with a channel width of 80 μm and a height of 35 μm was fabricated.The results show that by using the ultrasonic stress relief technology,the SU-8 mould defects caused by large internal stress in SU-8 layer are overcome,the capacity of manufacturing microinjection mold via UV-LIGA technology is enhanced,and the success rate of microinjection mold fabrication is greatly improved.