Abstract:SU-8 photoresist can be used to produce high aspect ratio and three-dimensional (3D) lithographic patterning based on standard contact lithography equipment due to its excellent coating, planarization, and processing properties and thus has become the favorite photoresist material for the fabrication of various microelectromechanical system (MEMS) structures and devices. However, as feature sizes get smaller and pattern complexity increases, particular difficulties arise and need to be carefully considered. The accuracy and precision, with which a feature on a mask can be reproduced throughout a thick resist structure, will depend on key parameters in the setup, the material properties of the SU-8 resist, and the thickness of the resist structure. Modeling and simulation studies may help improve our understanding and process design of the SU-8 lithography, thereby allowing rapid product and process development. In this chapter, the basic process and mechanism of UV lithography of the SU-8 are introduced briefly. Various models for the lithography, including the aerial image model, exposure model, postexposure bake model, and development model, are presented and discussed. Main algorithms for the etching surface advancement simulation, including the string, ray-tracing, cellular automaton, and fast-marching algorithms, are then compared and analyzed. Simulations of the UV lithography of the SU-8 are presented, and a series of experiments have been performed for SU8 2000 series photoresists under UV source with 365 nm (2.6 mW/cm2) radiation. The simulation results demonstrate to be in agreement with the experimental results. This is useful to optimize the inclined UV lithography processes of SU8 photoresists and to accurately design and control the dimensions of some MEMS microstructures. Z.-F. Zhou (*) • Q.-A. Huang Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China e-mail: zfzhou@seu.edu.cn; hqa@seu.edu.cn # Springer Nature Singapore Pte Ltd. 2017 Q.-A. Huang (ed.), Micro Electro Mechanical Systems, Micro/Nano Technologies, https://doi.org/10.1007/978-981-10-2798-7_3-1 1

Simplified microfabrication technology for producing SU-8 microstructures with high aspect ratio

Fabrication of high aspect ratio metallic microstructures on ITO glass substrate using reverse-side exposure of SU-8

Process Research of High Aspect Ratio Microstructure Using SU-8 Resist

Fabrication of High-Aspect-ratio Microstructures Using SU8 Photoresist

Fabrication of Su-8 Moulds on Glass Substrates by Using A Common Thin Negative Photoresist As an Adhesive Layer

A New Fabrication Process for Uniform SU-8 Thick Photoresist Structures by Simultaneously Removing Edge Bead and Air Bubbles

Thick SU8 Microstructures Prepared by Broadband UV Lithography and the Applications in MEMS Devices

Fabricating SU-8 Photoresist Microstructures with Controlled Convexity–Concavity and Curvature through Thermally Manipulating Capillary Action in Poly(dimethylsiloxane) Microholes

Process Study of High - Aspect - Ratio Ultrathick SU - 8 Microstructure

Fabrication Of 3d Su-8 Photoresist Microarrays Via Inclined Uitraviolet Lithography

Single-photon-multi-layer-interference lithography for high-aspect-ratio and three-dimensional SU-8 micro-/nanostructures

Fabrication of a Three-Layer SU-8 Mould with Inverted T-shaped Cavities Based on a Sacrificial Photoresist Layer Technique

Fabrication of Three-Dimensional SU-8 Microstructures for MEMS Applications

Fabrication of High Aspect-Ratio Microstructure on Improved Titanium Substrate with Excellent Adhesive Strength and SU-8 Photoresist

Ultrathick SU-8 fabrication for microreciprocating engines

Residual stress release for SU-8 structures by water assist ultrasonic

Modeling and Simulation of SU-8 Thick Photoresist Lithography

Research of Reducing Sidewall Roughness of SU-8 Microstructures

A New Fabrication Method for 3D Multilayer Microstructure

A novel method to fabricate complex three-dimensional microstructures

Modeling, Simulation and Experimental Verification of Inclined UV Lithography for SU-8 Negative Thick Photoresists