Simulation of Pattern Transfer Accuracy on SU-8 Resist

田学红,刘刚,田扬超,张新夷
DOI: https://doi.org/10.3969/j.issn.1672-7126.2002.06.005
2002-01-01
Abstract:Microstructure with high aspect ratio is widely used in MEMS(micro electromechanical system). But it is hard to fabricate microstructure with high precision and high aspect ratio due to Fresnel diffraction. The pattern transfer accuracy of deep UV-lithography was investigated. The SEM pictures were used to measure the width of the resist structure in different depths. The good agreement between the experimental and theoretical results allows to get the high pattern transfer accuracy microstructure through optimizing exposure dose for different resist thickness.
What problem does this paper attempt to address?