Ultra-shallow Junctions Formed Using Microwave Annealing

Peng Xu,Chaochao Fu,Cheng Hu,David Wei Zhang,Dongping Wu,Jun Luo,Chao Zhao,Zhi-Bin Zhang,Shi-Li Zhang
DOI: https://doi.org/10.1063/1.4799030
IF: 4
2013-01-01
Applied Physics Letters
Abstract:Microwave annealing is shown to be viable for achieving low thermal budget formation of ultra-shallow junctions. Regrowth of a 10 nm thick amorphous Si layer that is generated during a Ge amorphization process prior to BF2 or As dopant implantation proceeds at rates up to 0.53 nm/min for BF2 and up to 0.33 nm/min for As at 370 °C. The fraction of electrical activation for implanted dopants is as high as 13% for BF2 and 32% for As with negligible diffusion at 540 °C.
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