Abstract:Three-dimensional (3D) integrated circuit (IC) is regarded as an important way for the enhancement on the performance and integration density of IC to cope with the challenge of "the ending of the Moore's law".The 3D IC is suitable for the high density or heterogenous integration applications for its multi-layer stacked structure.Memory is one of the important applications of 3D integration technology for it is a typical high density product.3D memory,which increases memory density and bandwidth of memory access path simultaneously,is a promising solution of the "memory wall problem".With the scaling down of memory devices,the amount of faulty cells in memory array increases rapidly,it gives rise to the requirement of the build in self-repair (BISR) technique for acceptable memory reliability.The through silicon vias (TSVs),which works as the vertical signal paths in 3D memory,enable the inter-die sharing techniques of redundant resources for higher utilization ratio.This work proposes a sharing strategy of adjacent redundant cells across dies for better repair capability.This strategy is deadlock free,and it has good utility of redundant resources and relatively small area overhead of through silicon vias (TSVs).Simulation results show that,comparing with the published die-pair sharing strategy,the proposed strategy obtains higher repair rate.Furthermore,the proposed BISR has no obvious drop of repair rate with respect to the increase of the layer count,implying a good applicability in the large scale 3D memories.

Yield and Reliability Enhancement for 3D ICs

A TSV Repair Method for Clustered Faults

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

Adaptive 3D-IC TSV Fault Tolerance Structure Generation

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

A Die Selection and Matching Method for Yield Enhancement of 3D-Stacked Memories

Thermal–Mechanical and Signal Reliability of a New Differentiated TSV

An Optimization Algorithm for Pre-Bond TSV Probing Tests and Fault Localization

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant Tsvs

Modeling TSV Open Defects in 3D-Stacked DRAM

Reliable Design of Electroplated Copper Through Silicon Vias

Impact of Technology Scaling on Electrical Characteristics of Through-Silicon Via Correlated with Equivalent Circuits

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

Prebiotic carbohydrates in human milk and formulas.

Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

A BISR Scheme for 3D Stacked Memory by Sharing Adjacent Redundancy Cells Across Dies

Improved Multilevel Routing with Redundant Via Placement for Yield and Reliability

Toward Reliability- and Variability-Aware Design-Technology Co-Optimization in Advanced Nodes: Defect Characterization, Industry-Friendly Modeling, and ML-Assisted Prediction