Low-Temperature Materials And Thin Film Transistors For Flexible Electronics

Y. L. Li,X. He,X. Lin,B. B. Jiang,S. J. Li,S. D. Zhang
2011-01-01
Abstract:The paper reviews the material requirements of nanocrystalline silicon (nc-Si) in terms of thin film transistors (TFTs) and configuration for display application. We studied the material qualities of nc-Si films deposited by 13.56 MHz plasma-enhanced chemical vapor deposition (PECVD) from a conventional H-2 dilution in SiH4 at low temperature. Some types of intrinsic nc-Si films deposited at the high pressure and the low pressure were studied. A further improvement in the nc-Si:H film structure and properties is obtained by adjusting the r.f. power and the deposition temperature. The material properties were characterized with Raman spectroscopy measurements to reveal 76% of crystalline volume fraction. The nc-Si crystalline were mainly determined by the ratio of H and SiH3[1-3]. The nc-Si with optimized deposition condition was used as the channel layers of TFTs to investigate the effect of nc-Si qualities for the TFTs application.
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