The mechanism of hydrogen plasma passivation for poly-Si thin film

Juan LI,Zheng-peng LIU,Chong LUO,Zhi-guo MENG,Shao-zhen XIONG
DOI: https://doi.org/10.3969/j.issn.1001-9731.2014.03.020
2014-01-01
Abstract:The mechanism of hydrogen plasma passivation for poly-Si thin films has been investigated.It has been found that different kind of hydrogen plasma radical was responsible for different defects passivation for poly-Si. The Hαwith low energy was mainly responsible for passivating the dangling-bond defects.The H* with higher energy may passivate the defects related to Ni impurity around the grain boundaries more effectively.In addi-tion,the Hβand Hγwith the highest energy are required to passivate intra-grain defects.These analysis and re-sults are very usable to optimize the H plasma passivation and make the passivation more effective.
What problem does this paper attempt to address?