Si Surface Passivation By Siox:H Films Deposited By A Low-Frequency Icp For Solar Cell Applications

H. P. Zhou,D. Y. Wei,S. Xu,S. Q. Xiao,L. X. Xu,S. Y. Huang,Y. N. Guo,S. Khan,M. Xu
DOI: https://doi.org/10.1088/0022-3727/45/39/395401
2012-01-01
Abstract:Hydrogenated silicon suboxide (SiOx : H) thin films are fabricated by a low-frequency inductively coupled plasma of hydrogen-diluted SiH4 + CO2 at a low temperature (100 degrees C). Introduction of a small amount of oxygen into the film results in a predominantly amorphous structure, wider optical bandgap, increased H content, lower conductivity and higher activation energy. The minority carrier lifetime in the SiOx : H-passivated p-type Si substrate is up to 428 mu s with a reduced incubation layer at the interface. The associated surface recombination velocity is as low as 70 cm s(-1). The passivation behaviour dominantly originates from the H-related chemical passivation. The passivation effect is also demonstrated by the excellent photovoltaic performance of the heterojunction solar cell with the SiOx : H-based passivation and emitter layers.
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