Ni/Ag Reflector Electrode of GaN-Based Vertical LED

Qingdian Bu,Lunmao Zhou,Hao Long,Leiying Ying,Zhiwei Zheng,Baoping Zhang
DOI: https://doi.org/10.13290/j.cnki.bdtjs.2017.08.006
2017-01-01
Abstract:The Ni/Ag/Ti/Au metal reflector electrode is widely used in the GaN-based vertical structured light-emitting diode(LED),traditional fabrication process.However,the formation of ohmic contact with high quality needs a high temperature and long time annealing,which deteriorates the reflectivity of the reflector and the performance of the device.A new method based on the concept of decoupling the reflector electrode into a contact layer and a reflection layer was introduced,and the annealing time and the temperature were reduced by this method.The reflector electrode with good ohmic contact characteristics and high reflectivity was obtained,which solved the problem that the optical and electrical properties of the conventional electrode were mutually restricted.Firstly,an extremely thin Ni/Ag contact layer was deposited as the contact layer.After long-time annealing with high temperature for the contact layer,the thick layer Ag metal was deposited as the reflecting layer,then followed by a low temperature annealing.In the above process,the refecting layer,which plays a major role in the reflection,is free from high temperature and long time annealing.Compared with the traditional Ni/Ag/Ti/Au electrode,the method achieves better ohmic contact and greatly improves the reflectivity of the electrode.After annealing of the contact layer at 500 ℃ for 3 min and annealing of the whole structure at 400 ℃ for 1 min,both in oxygen atmosphere,the specific contact resistivity of the electrode reaches 1.70× 10-3 Ω · cm2 and the reflectivity reaches 93% at the wavelength of 450 nm.
What problem does this paper attempt to address?