Abstract:Cu-Cr alloy is a kind of promising materials used as conductor due to its good strength and high conductivity. Heavy cold deformation could increase the strength effectively. Most of Cu and Cr phase are elongated into filaments during cold drawing. There exits plenty of Cu/Cr interface and the structure of Cu/Cr interface is thought to play an essential role in the properties of the Cu-Cr alloy. In this work, Cu-Cr wires were prepared by cold drawing method. The evolution of the microstructure and the structural change of phase interface during cold drawing have been investigated and the relationship between properties and microstructure also established. The microstructure consists of Cu matrix and Cr particles before cold drawing. As the drawing strain increases, both of Cu and Cr phases evolve into filamentary structure. Some residual Cr particles are still found in the alloy even at high drawing ratio. There is a relationship of (111)(Cu)//(110)(Cr) between Cu fibers and Cr fibers at high strain levels. The Cu/Cr interface is non-coherent before cold drawing and gradually evolves into the coherent interface at high drawing strains. The inter-solution ability of Cu and Cr elements across the Cu/Cr interface is enhanced with the increase in the drawing strain. The coherent Cu/Cr interface and the increasing of interface density should be responsible for the strength rising to an almost constant value and the increase in electrical resistivity of Cu-Cr alloys at high strain levels.

Effects of Drawing Strain on Formation of Filamentary Structure and Conductivity for Cu-12%Ag Alloy

Strain Compatibility Behavior in Cu-6%Ag Alloy During Drawing into Filamentary Structure

Evolutions of the microstructure and electrical conductivity of Cu-6wt%Ag alloy during drawing strain

Tensile strength and Young's modulus of Cu-Ag alloys in the evolution of microstructure into filamentary composites

Relationships between mechanical strength and electrical conductivity for Cu–Ag filamentary microcomposites

Evolution of microstructure and electrical resistivity of Cu–12wt.%Ag filamentary microcomposite with drawing deformation

Microstructure evolution and properties of Cu–Ag microcomposites with different Ag content

EFFECTS OF Ag CONTENT ON MICROSTRUCTURE AND PROPERTIES OF THE FILAMENT STRENGTHENED Cu-Ag ALLOYS

Effects of solute, temperature and strain on the electrical resistivity of Cu–Ag filamentary composites

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

EFFECT OF HEAVILY DRAWING ON THE MICROSTRUCTURE AND PROPERTIES OF Cu-Cr ALLOYS

Effects of Drawing Strain on Intensity and Distribution of Crystal Texture in Cu-12%Ag Alloy

Morphology Evolution of Two-Phase Cu-Ag Alloys under Different Conditions

Effects of rare-earth additions on the microstructure and strength of Cu–Ag composites

Microstructure and Hardness of Cu-12% Fe Composite at Different Drawing Strains

Research and Development on Microstructure, Properties and Alloying of Cu-Ag Filamentary Composites

Strain Strengthening Of Ag-10cu In Situ Filamentary Composite Prepared By Heavy Deformation

The characteristics of Cu–12wt.% Ag filamentary microcomposite in different isothermal process

Effects of Cr and Zr additions on the microstructure and properties of Cu-6wt.% Ag alloys

Effects of Heat Treatment Temperature on Microstructure and Properties of Wiredrawn Cu-12ag Filamentary Composite

Microstructure and Properties of Heavily Drawn Cu-Ag-Fe Composites