Abstract:The Cu-12wt.%Ag microcomposite was prepared by heavy cold drawing and intermediate heat treatment. The influence of isothermal processes on the microstructure and properties of the alloy was investigated at various temperatures for different annealing time. Isothermal treating at 200 degrees C fails to change the fibrous morphology of the strengthened phase and results in the slightly decreased ultimate tensile strength and slightly increased electrical conductivity. Isothermal annealing treating at 300 degrees C results in a partial migration of the phase interface. The electrical conductivity obviously increases and the ultimate tensile strength evidently decreases in an initial isothermal annealing period. After this, the increase of the electrical conductivity and the decrease of the ultimate tensile strength become slow. Isothermal annealing treating at 400 degrees C promotes the significant recrystallization and the grain propagation in the deformed structure. The electrical conductivity greatly increases and the ultimate tensile strength severely loses in an initial isothermal period. With prolonging isothermal annealing time, the ultimate tensile strength loses slowly and the electronic conductivity also shows a slow reduction after reaching a maximum value. The factors of recovery, recrystallization, precipitation of secondary particles, dissolution of the solute atoms, etc. in the fibrous structure during isothermal annealing processes can be used to explain the changes of microstructure and properties of the alloy.

Relationships between mechanical strength and electrical conductivity for Cu–Ag filamentary microcomposites

Microstructure evolution and properties of Cu–Ag microcomposites with different Ag content

Research and Development on Microstructure, Properties and Alloying of Cu-Ag Filamentary Composites

EFFECTS OF Ag CONTENT ON MICROSTRUCTURE AND PROPERTIES OF THE FILAMENT STRENGTHENED Cu-Ag ALLOYS

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

Tensile strength and Young's modulus of Cu-Ag alloys in the evolution of microstructure into filamentary composites

The characteristics of Cu–12wt.% Ag filamentary microcomposite in different isothermal process

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Strain Compatibility Behavior in Cu-6%Ag Alloy During Drawing into Filamentary Structure

Effects of rare-earth additions on the microstructure and strength of Cu–Ag composites

Effect of annealing processes on microstructure, mechanical properties and conductivity of Cu-12%Ag alloy composite-reinforced by fibers

Microstructure and properties of Cu–Ag, Cu–Ag–Cr and Cu–Ag–Cr–RE alloys

Effects of Cr and Zr additions on the microstructure and properties of Cu-6wt.% Ag alloys

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Effects of Drawing Strain on Formation of Filamentary Structure and Conductivity for Cu-12%Ag Alloy

Microstructure and Properties of Heavily Drawn Cu-Ag-Fe Composites

Reforming Nanostructured CuAg Alloy to Improve Ductility and Electrical Conductivity

Attaining Exceptional Electrical Conductivity in Cu-Fe Composite by Powder Rolling Strategy

Evolutions of the microstructure and electrical conductivity of Cu-6wt%Ag alloy during drawing strain

Effects of solute, temperature and strain on the electrical resistivity of Cu–Ag filamentary composites

Evolution of microstructure and electrical resistivity of Cu–12wt.%Ag filamentary microcomposite with drawing deformation