Abstract:The Cu–12wt.% Ag microcomposite with a filamentary structure of double phases was prepared by heavy cold drawing and intermediate heat treatments. The influence of isothermal processes on the microstructure and properties was investigated by annealing the microcomposite at various temperatures for different time. The strength slightly decreases and the conductivity slightly increases but the filamentary morphology is still kept during the isothermal treatment at 200°C. The hardness decreases in initial isothermal period and then increases with prolonging isothermal time. The decrease in strength and the increase in conductivity are more significant during the isothermal treatment at 300°C than at 200°C because the filamentary structure evolved from eutectic colonies coarsens and changes into crystallite clusters in long isothermal period. Recrystallizing presented in initial isothermal period at 400°C converts the filamentary phases into small equiaxial grains and results in the great decrease in strength and the quick increase in conductivity. Significant propagation of recrystallized grains at 400°C with prolonging isothermal time results in gradual disappearance of the filamentary morphology. However, the strength reduction becomes slow and the conductivity also decreases after a maximum value is reached.

Evolution of microstructure and electrical resistivity of Cu–12wt.%Ag filamentary microcomposite with drawing deformation

Tensile strength and Young's modulus of Cu-Ag alloys in the evolution of microstructure into filamentary composites

Evolutions of the microstructure and electrical conductivity of Cu-6wt%Ag alloy during drawing strain

Microstructure evolution and properties of Cu–Ag microcomposites with different Ag content

Microstructure Evolution of Cu/Ag Interface in the Cu–6 Wt.% Ag Filamentary Nanocomposite

Strain Compatibility Behavior in Cu-6%Ag Alloy During Drawing into Filamentary Structure

Relationships between mechanical strength and electrical conductivity for Cu–Ag filamentary microcomposites

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

Effects of Drawing Strain on Formation of Filamentary Structure and Conductivity for Cu-12%Ag Alloy

Research and Development on Microstructure, Properties and Alloying of Cu-Ag Filamentary Composites

Microstructure and Properties of Heavily Drawn Cu-Ag-Fe Composites

The characteristics of Cu–12wt.% Ag filamentary microcomposite in different isothermal process

Morphology Evolution of Two-Phase Cu-Ag Alloys under Different Conditions

EFFECTS OF Ag CONTENT ON MICROSTRUCTURE AND PROPERTIES OF THE FILAMENT STRENGTHENED Cu-Ag ALLOYS

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Attaining Exceptional Electrical Conductivity in Cu-Fe Composite by Powder Rolling Strategy

Co-deformation in Cu–6 Wt.% Ag Nanocomposites

Microstructure and Hardness of Cu-12% Fe Composite at Different Drawing Strains

Effects of rare-earth additions on the microstructure and strength of Cu–Ag composites

Effects of solute, temperature and strain on the electrical resistivity of Cu–Ag filamentary composites

Microstructure and properties of Cu-Ag alloy prepared by continuously directional solidification