Research and Development on Microstructure, Properties and Alloying of Cu-Ag Filamentary Composites
HE Jia,LIU Jiabin,MENG Liang
DOI: https://doi.org/10.3321/j.issn:1005-023x.2006.10.023
2006-01-01
Abstract:An overview of the microstructure evolution,mechanical properties,electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition,strain degree,intermediate heat treatments and final annealing processes. These factors strongly affect the solute solubility,phase proportion,microstructure component volume,microstructure morphology,filamentary distribution and consequently strain hardening level and electron scattering behavior. Optimum technology of materials preparation can result in high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that the relative mechanisms responsible for strain strengthening and electron conducting and the processes for material preparation should be further investigated for the development and application of the microcomposites.