Evolutions of the microstructure and electrical conductivity of Cu-6wt%Ag alloy during drawing strain

Weijuan Lou,Lei Zhang,Liang Meng

DOI: https://doi.org/10.3321/j.issn:1002-185X.2006.z2.091

2006-01-01

Rare Metal Materials and Engineering

Abstract:Cu-6 wt%Ag filamentary composite was prepared by cold drawing. The characteristics of filamentary microstructure and electrical resistivity under different strain condition were investigated and the effect of strain on the electrical conductivity was discussed. With increasing the draw ratio, the Cu-rich dendrites, the eutectic colonies and the Ag precipitates in the as-cast and homogenized structure develop into the fine filamentary structure, resulted in the increase of electrical resistivity. The change in the electronic scattering effect of the phase interface between Ag precipitates and Cu grains and the interface between eutectic filamentary bundles and Cu matrix in the alloy against the dislocation resulted in the change in the electrical resistivity of alloy for different strain condition. For high draw ratios, the change of the electrical resistivity with strain is generally in accord with the interfacial scattering model proposed in the presented investigation on the composites with higher Ag contents when the filamentary structure evolves into nanoscale.