Abstract:The effects of cold drawing process on the microstructure, mechanical properties and electrical conductivity of low-oxygen copper wires were studied. The results show that at low drawing strains (ε ≤ 1.23), the plastic deformation is dominated by planar slip, some of grains are rotated along the drawing direction, giving rise to a <111> texture. At medium strains (1.23 < ε ≤ 1.91), most of grains have re-oriented and laid parallel to the drawing direction, and the <111> and <100> textures are highly developed. At high strains (ε > 1.91), a fibrous structure is formed, with a staggered distribution of <111> and <100> textures. With the increase of drawing strain, the volume fraction of the <111> texture first increases and then decreases, while the volume fraction of the <100> texture increases monotonously. The yield strength first increases and then decreases, yielding the maximum value of 427.5 MPa at the strain of 1.91. Interestingly, the electrical conductivity of the copper wires changes with cold drawing strain and moves in the opposite way to the yield strength. The electrical conductivity first decreases and then increases with the minimum value at a strain of 1.91 (~87.5% IACS). At strains higher than 2.74, dynamic recrystallization occurs, resulting in a decrease in dislocation density and an increase in grain size. In addition to the dislocation density and grain size, the yield strength of the copper wires is further impacted by the texture development. The electrical conductivity is less influenced by dislocations and vacancies. Instead, it is dominated by those grain boundaries perpendicular to the drawing direction. An excellent strength-conductivity combination was achieved by tailoring the microstructure of copper wires. For example, a wire with the yield strength (YS) of 400.5 MPa and electrical conductivity (EC) of 94.3% IACS was acquired when the drawing strain reaches 2.74.

EFFECT OF HEAVILY DRAWING ON THE MICROSTRUCTURE AND PROPERTIES OF Cu-Cr ALLOYS

Microstructure and Properties of Cold Drawing Cu-2.5% Fe-0.2% Cr and Cu-6% Fe Alloys

The effect of cold drawing on the structure, tensile fracture strength and reliability of CuZrAl amorphous microwires

Microstructures and properties of cold drawn submicron crystalline Cu-5wt%Cr material

Microstructure and Properties of Cold-Drawn Cu and Cu-Fe Alloy Wires

Effects of Cr and Zr additions on the microstructure and properties of Cu-6wt.% Ag alloys

Strain Compatibility Behavior in Cu-6%Ag Alloy During Drawing into Filamentary Structure

Investigation on the Dual-Phase Co-Deformation Behavior and Strengthening Mechanism in Cold-Drawn Cu–20Fe Alloy

Recovery, Recrystallization and Thermal Stability of Submicron Crystalline Cu-5%Cr after Cold Drawing

Effect of drawing deformation on microstructure and mechanical properties of Fe-Cr-Co-W alloy

Microstructure Evolution and Mechanical Properties of High Strength and High Conductivity CuFe Alloy Wire Prepared by Cold Drawing

Ductile Chromium in Heavily Cold-Drawn Cu 75 Cr 25 Alloy

Influences of Fe Content and Cold Drawing Strain on the Microstructure and Properties of Powder Metallurgy Cu-Fe Alloy Wire

Temperature Dependence of Microstructure and Texture in Cold Drawn Aluminum Wire

Effect of Cold Drawing Strain on the Microstructure, Mechanical Properties and Electrical Conductivity of Low-Oxygen Copper Wires

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

Structure evolution of Cu-3.6% Al2O3 alloy fine wire during cold drawing

Effects of Alloying Elements on Microstructure, Mechanical and Electrical Properties of Cu-Ag Based Alloys

Effects of cold deformation and aging on the phase transformation and mechanical properties of a Cu-15Ni-8Sn alloy

Effect of Deformation Processes on Properties of Cu-Cr-Zr Alloy

Effects of Drawing Strain on Formation of Filamentary Structure and Conductivity for Cu-12%Ag Alloy