Plasma Influences on the Performance of Ti Protected Back-Channel-Etched A-Igzo TFTs

Letao Zhang,Qian Ma,Shengdong Zhang
DOI: https://doi.org/10.1109/edssc.2019.8754072
2019-01-01
Abstract:A back-channel-etched process with Ti protective layer was used to fabricate the amorphous a-IGZO TFTs. To oxidize the Ti to TiO 2 on the back channel, kinds of plasma treatments were imposed to the Ti protective layer. The device with N 2 O plasma at 300°C in PECVD exhibits superior oxidizing effect, which is well compatible with large area production.
What problem does this paper attempt to address?