Rapid Improvement in Thin Film Transistors with Atomic-Layer-Deposited InOxChannels Via O2Plasma Treatment

Qian Ma,Yan Shao,Y. -P. Wang,H. -M. Zheng,B. Zhu,W. -J. Liu,Shi-Jin Ding,D. W. Zhang
DOI: https://doi.org/10.1109/led.2018.2869019
IF: 4.8157
2018-01-01
IEEE Electron Device Letters
Abstract:To improve the electrical performance of thin-film transistors with an atomic-layer-deposited Al2O3 dielectric/InOx channel, O-2 plasma surface treatments of the InOx back channel are explored in comparison with thermal annealing. It is demonstrated that the O-2 plasma treatment can enhance the device performance much more efficiently than thermal annealing, exhibiting an extremely low-thermal budget. Furthermore, it is revealed that the plasma treatment at a higher temperature can improve the device performance much faster than that at a lower temperature. For a 4 min O-2 plasma treatment at 200 degrees C, superior electrical characteristics are achieved, such as a field-effect mobility of 11 cm(2) V-1 s(-1), a threshold voltage of 0.9 V, a sub-threshold swing of 0.38 V/dec, and good gate bias stress stabilities. This is ascribed to faster passivation of oxygen vacancies, removal of more C residues, and weaker surface damage and smaller surface roughness of the InOx back channel in comparison with long plasma treatments at lower temperatures.
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