Fast Improved Thin-Film Transistors with Atomic-Layer-Deposited In2O3 Channels Via O2 Plasma Treatment

Qian Ma,Letao Zhang,Shengdong Zhang
DOI: https://doi.org/10.1109/edssc.2019.8754081
2019-01-01
Abstract:High performance thin-film transistors (TFTs) with atomic-layer-deposited In 2 O 3 channel and Al 2 O 3 gate dielectric were fabricated under a maximum process temperature of 200°. As-fabricated and O 2 annealed devices show a conductor-like behavior because of very high carrier concentration in the channels. Compared to the O 2 annealing, the O 2 plasma treatment can be a much more efficient approach for fast improvement of TFTs by substantially reducing the amount of oxygen vacancies. The In 2 O 3 TFT treated by O 2 plasma demonstrates a field-effect mobility of 11 cm 2 V -1 s -1 , a threshold voltage of 0.9 V, a subthreshold swing of 0.38 V/dec, and an on/off current ratio of 10 7 . Moreover, the device stability is enhanced markedly if the treatment temperature increases. This could be mainly due to the decrease of -OH/CO groups in the In 2 O 3 film, which is evidenced by X-ray photoelectron spectroscopy.
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