Silicon Carbide Bipolar Junction Transistor with Novel Emitter Field Plate Design for High Current Gain and Reliability

Yourun Zhang,Hang Chen,Maojiu Luo,Juntao Li,Wen Wang,Xiaochuan Deng,Yun Bai,Hong Chen,Bo Zhang
DOI: https://doi.org/10.1088/1361-6641/ab032c
IF: 2.048
2019-01-01
Semiconductor Science and Technology
Abstract:A silicon carbide bipolar junction transistor with novel emitter field plate (El-P-BJT) design is proposed in this paper. The fabricated EFP-BJT features a metal plate of the extending emitter electrode with a 50-nanometer-thick oxide layer overlapped on the extrinsic base surface. The contrast of experimental results show that a 56% increase of maximum current gain is obtained by the EFP-BJT compared with a conventional SiC BJT (C-BJT), with the El-P-BJT's current gain of 43 measured at the collector current density (J(c)) of 716 A cm(-2) corresponding to a specific on-state resistance (R-SP_ON) of 5.4 m Omega . cm(2) and open-base breakdown voltage (BVCEO) of 1.5 kV. The novel EFP-BJTs are entirely compatible with the process and design considerations of the conventional ones. The in-depth mechanism comparisons between the proposed EFP-BJT and C-BJT are studied by the simulation tool TCAD Silvaco. The surface recombination effect of EFP-BJT is greatly reduced by the modulation of the emitter field plate. Additionally, due to the surface recombination suppression of the novel structure, EFP-BJTs have effectively enhanced reliability. Compared with C-BJTs, there is no significant degradation of the collector current for the fabricated EFP-BJTs under the forward current stress test.
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