A Novel High-Voltage Trench Gate Insulated Gate Bipolar Transistor With Diffusion Remnant Layer

Bin Zhang,Yan Han,Shifeng Zhang,Dazhong Zhu,Wei Zhang,Huanting Wu,Fang Liu
DOI: https://doi.org/10.1587/elex.10.20130719
2013-01-01
IEICE Electronics Express
Abstract:A novel high-voltage trench gate insulated gate bipolar transistor with diffusion remnant (DR) layer (DR-IGBT) is proposed in this letter. The DR layer in the emitter side which is formed by grinding after ultra-deep N+ diffusion helps to stored the carrier and improves the on-state voltage drop (V-ce(SAT)). The DR-IGBT has a better trade-off between the breakdown voltage (BV) and V-ce(SAT) than the carrier stored trench bipolar transistor (CSTBT). The doping profile of diffusion remnant layer makes the junction of the pbase/DR layer nearly linearly graded junction, which does not decline the BV too much. The depth of the diffusion remnant layer and N+ diffusion layer less impacts BV and V-ce(SAT) unless the diffusion depth is reduced.
What problem does this paper attempt to address?