Abstract:The mechanical strengths of silicon wafers are crucial for the manufacturing yield of integrated circuits (ICs), which have received intensive attention over the years. With reducing the feature size of ICs, the mechanical strengths of silicon wafers become more significant. Actually, the gliding of indentation dislocations on single-crystalline silicon wafers at a given temperature reflects the mechanical strengths of silicon wafers. Since the gliding of indentation dislocations is driven by the residual stress around the indentation, the investigation on the correlation between the residual stress and dislocation gliding is of significance. In this paper, we first use micro-Raman microscopy to characterize the relief of stress around the indentation due to the annealling at 300 or 500 ℃. Then the effect of such a relief-stress on the gliding of indentation dislocations at 700-900 ℃ is investigated. In the case without the prior stress-relief, the indentation dislocations glide to the maximum distance after 2 h annealling at 700-900 ℃. With the prior stress-relief due to the annealling at 300 or 500 ℃, the indentation dislocations can still glide to the maximum distance after 2 h annealling at 900 ℃, however the gliding velocity significantly decreases and the gliding distance is remarkably reduced after 2 h annealling at 700 or 800 ℃. Such a reduction of gliding distance is most significant in the case of 700 ℃ annealling following the stress-relief with the 500 ℃/2 h annealling. Despite the prior stress-relief, as long as the annealing time at 700 or 800 ℃ is sufficiently extended, the indentation dislocations can glide to the maximum distance. In view of the above results, it is believed that the maximum gliding distance of indentation dislocations at a given temperature is independent of the values of residual stress around the indentation provided that the residual stresses are larger than the critical stress for driving the dislocation movement. Nevertheless, the annealing time for achieving the maximum gliding distance at a given temperature should be remarkably extended as the residual stresses around the indentation are relieved.

Relaxation of Thermal Residual Stress in Laser Irradiated Fused Silica by Annealing Process

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Investigation on the influence of the CO2 laser parameters on the defect healing process of fused silica

Effects of annealing on thermal stress generation during the cooling process of large-size silica glass

Morphology evolution mechanisms and localized structural modification of repaired sites on fused silica optics processed by CO2 laser rapid ablation mitigation

Material migration and damage characteristics of fused silica optical surface treated by CO 2 laser/short – pulse ultraviolet laser

A Numerical Model to Reduce Thermal Residual Stress During Cooling and Annealing Process of Large Optical Glass Production

Study on thermal stress of the the fused silica irradiated by millisecond–nanosecond combined pulse laser

Research on Laser-Induced Damage Post-Restoration Morphology of Fused Silica and Optimization of Patterned CO2 Laser Repair Strategy

Stress in femtosecond-laser-written waveguides in fused silica

Numerical Analysis of the Temperature Field during Single-pass Two-layers Laser Additive Manufacturing of Fused Silica Glass

Effects of Thermal Annealing on Femtosecond Laser Micromachined Glass Surfaces

Effect of Prior Stress-Relief on the Gliding of Indentation Dislocations on Silicon Wafers

Optimization of Laser Glazing Parameters for Reduction of Residual-Stress

Energy-dependent correlation between micro/nano-morphology and stress state of femtosecond laser-induced modification in fused silica

Molecular Dynamic Simulation of Non-Melt Laser Annealing Process

Heat accumulation effect during CO2 laser processing of fused silica optics

An Overview of the Thermal Erasure Mechanisms of Femtosecond Laser‐Induced Nanogratings in Silica Glass

X-ray stress measurement of SiC single-crystal induced by laser ablation

Calculation of Thermal and Mechanical Effect Induced by Laser in Optical Window Materials

Repair of Fused Silica Damage Using Selective Femtosecond Laser-Induced Etching