Optimization of Bath Composition for Electroless Copper Plating on Aluminum Nitride Ceramic Surface

王晓虹,张金强,冯培忠,孙智
DOI: https://doi.org/10.19289/j.1004-227x.2009.12.008
2009-01-01
Abstract:The effect of bath composition of electroless copper plating on aluminum nitride (AlN) ceramic surface on the plating speed and surface roughness was studied by orthogonal test. The influence degree of individual component on electroless plating was estimated by intuitive and variance analysis, and the bath composition was optimized. The test results showed that CuSO4·5H2O and Na2EDTA have a remarkable effect on the plating speed, and KNaC4H4O6, CuSO4·5H2O and Na2EDTA have a great influence on the surface roughness. The optimal process parameters of the bath for electroless copper plating on AlN ceramic surface are as follows: CuSO4·5H2O 24 g/L, Na2EDTA 30 g/L, KNaC4H4O6 20 g/L and HCHO 15 mL/L. In the optimal conditions, the plating speed is 7.350 μm/h, the surface roughness of deposit is 1.03 μm and an level surface and uniform grain size of copper were observed.
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