Abstract:In this work, we successfully developed an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB). Based on the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent throwing power are carefully investigated. The UV‐vis spectroscopy results illustrate that En exhibits a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion is 2:1. The linear sweep voltammetry (LSV) results show that the electro‐reduction peak potential of Cit‐Cu coordination ion is ‐0.55 V (vs. Hg/HgO), while the En‐Cu ion is at a more negative potential of ‐0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy reveals that the adsorptions of the Cit‐Cu and En‐Cu coordination ions are of potential dependence on the copper electrode. The Cit‐Cu coordination ion is easily adsorbed at the interior sites of through holes with lower over‐potential to promote the growth of copper coating. Moreover, the En‐Cu coordination ion adsorbs preferably on the surface and the edge of through hole for its higher electro‐reduction overpotential, to hinder the germinating of copper nuclear. The cross‐section observation of optical microscope proves that the throwing power of novel copperelectroplating bath behaves surpassingly, up to 105.8%.

COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS

Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath

Electrodeposition of Nanostructured Co–Cu Thin Alloy Films on to Steel Substrate from an Environmentally Friendly Novel Lactate Bath under Different Operating Conditions

ZINC-NICKEL ALLOY ELECTROPLATING IN AN ALKALINE BATH

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Effects of Bath Temperature and Substrate on Surface Morphology of Electrodeposited Cu2O Thin Films

Effect of Electroplating Bath Composition on Corrosion Resistance of Deposited Cobalt Films

Role of Surfactants in Construction of Porous Copper Film by Electrodeposition Approach

Electroless Plating of Copper on Al2o3 and Its Heat Treatment Behaviour

Study of Electroplating Zn-Sn-Ni Alloy

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Parameters optimization of high stability bath for electroless copper plating

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

Electroplating of Ni_(70)Cu_(30) alloy from pyrophosphate bath

Electrochemical deposition and stripping of copper, nickel and copper nickel alloy thin films at a polycrystalline gold surface: a combined voltammetry-coulometry-electrochemical quartz crystal microgravimetry study

Effect of Water Temperature, pH Value, and Film Thickness on the Wettability Behaviour of Copper Surfaces Coated with Copper Using EB-PVD Technique

Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma

The Performance of Zn-Ni Alloy Coating Electrodeposited from Stabilized Bath

Controlled Reactions On A Copper Surface: Synthesis And Characterization Of Nanostructured Copper Compound Films

Study of Electroless Ni-Zn-P Alloy Plating from Acidic Bath