Abstract:Chemical production of metal coatings is relevant and widely sought after. The field of practical use of chemical metal deposition reactions from aqueous solutions are continuously expanding. These reactions are widely used to obtain metal coatings for various purposes and begin to be used for the selective deposition of metals on a substrate in the form of patterns. Chemical copper plating has gained great practical importance. In additive and subtractive technology for the production of printed circuit boards, thick-layer chemical copper plating solutions are used to obtain a circuit diagram and metallization of holes. These are solutions that avoid the stage of galvanic copper plating, since the chemically deposited copper layer is sufficiently thick and allows further technological operations to be carried out. Chemical copper plating solutions must be stable, work with a sufficient copper plating rate and, most importantly, the resulting copper coatings have high physical and mechanical properties. This is due to the fact that during operation, printed circuit boards can be significantly heated, which leads to thermal expansion of both the board material and the copper coating. Due to the difference in the linear expansion coefficients of the substrate material and the deposited copper, significant stresses can occur in the copper layer deposited on the walls of the holes of the printed circuit board. When applying an inelastic copper coating, the layer breaks and the board exits the operating mode. This work is devoted to the study of the effect of some inorganic oxidizing agents on the properties of chemically precipitated copper, and this effect mainly affects the reduction of oxygen fragility. The mechanism of the process of chemical copper plating of a dielectric surface activated by palladium(II) salts is considered in detail. It is shown that at a high deposition rate of chemical copper, hydrogen is included in the coating, which leads to the appearance of “hydrogen” brittleness. Bubbling a solution of chemical copper plating with air increases the stability of the solution and can be used to oxidize certain forms of organic additives introduced into the solution to reduce hydrogen embrittlement. It is established that the incorporation of particles of copper oxide or hydroxide of monovalent copper into the copper coating leads to a decrease in the ductility of the copper coating and a decrease in the relative elongation of the chemically deposited copper layers. It was shown that in order to reduce the “oxygen” brittleness or increase the ductility of copper coatings, inorganic oxidants  ammonium persulfate and ferric sulfate salts must be introduced into the solution of chemical copper plating. Based on the experiments, it was found that in order to improve the ductility of the resulting copper coatings, ferric sulfate (Fe2(SO4)3∙9H2O) in the amount of 0.15-0.2 gl1. The conducted research cycle allowed us to recommend the following composition of a solution of thick-layer chemical copper plating, mol∙l–1: CuSO4 – 0.1; KNaTart – 0.21; NaOH – 0.375; Na2CO3 – 0.028; K3Fe(CN)6 – 3∙10–5; Fe2(SO4)3 – 3∙10–4; NiCl2 – 1.3∙10–2; ПАВ-2К – 0.1 g/l; formaldehyde – 25 mll1 40% solution. The solution is stable during operation, the coating deposition rate is from 3 to 4 μmh1, the plasticity of the resulting copper layers is 4-5%.

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Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution

Study on Chemical Activity of Electroless Copper Plating

Electroless Plating of Copper on Al2o3 and Its Heat Treatment Behaviour

Effects of deposition parameters of electroless copper plating on polyester fabric

Electroless Copper Plating on a Cotton Surface: Effect of Metal Ion Ligand Stability Constant on Reduction Deposition

Sustainable formaldehyde-free copper electroless plating on carbon-epoxy substrates

The Optimal Ratio of Acid Copper Electroforming Solution Based on UV-LIGA Process

Process Parameters Optimization of Electric Plating Ni-P Alloy Coating

Dependence of physical and mechanical properties of copper coatings on composition of chemical copper plating solution

Electroless plating of copper on carbon fiber surfaces and corresponding mechanism

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

High Speed Copper Plating Process for IC Substrate

Study on new process of electroless copper plating pretreatment on carbon fiber surface

Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity

COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS

Initial surface roughness of electrochemical plating copper under different conditions

Parametric Characterization of Copper Metal Coatings Produced by Supercritical Argon Electroplating

Temperature dependence of deposition behavior and corrosion resistance of zinc coatings electroplated on copper substrates from ethaline electrolyte

Modeling and optimization of surface quality of copper deposits recovered from brass scrap by direct electrowinning

Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards