Adhesion promotion for epoxy resin/copper and polyimide/copper joints by a two‐component coupling system of poly(4‐vinylimidazole) and cystamine

qiliang dai,yun lu
DOI: https://doi.org/10.1002/apmc.1995.052270112
1995-01-01
Angewandte Makromolekulare Chemie
Abstract:A two-component coupling agent layer on copper, produced by immersion of copper in poly(4-vinylimidazole) solution and then in cystamine solution, showed better anticorrosive performance and higher adhesive strength for epoxy resin and polyimide than each single component even at high temperature.
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