Abstract:Surface modification of Ar plasma-pretreated SiLK film coating on a (100)-oriented silicon wafer (SiLK-Si substrate) via UV-induced graft copolymerization with 4-vinylpyridine (the 4VP-g-SiLK-Si surface) or 1-vinylimidazole (the VIDz-g-SiLK-Si surface! was carried out to promote the adhesion with the electrolessly deposited copper. The surface composition of the graft-copolymerized SiLK-Si substrates was characterized by X-ray photoelectron spectroscopy. The topography of the 4VP-g- SiLK-Si and VIDz-g-SiLK-Si surfaces was investigated by atomic force microscopy. The 4VP-g- SiLK-Si and VIDz-g-SiLK-Si surfaces could be activated by PdCl2 in the absence of prior sensitization by SnCl2 (the Sn-free activation process! for the subsequent electroless deposition of copper. The 180degrees-peel adhesion strength of the electrolessly deposited copper on the 4VP-g- SiLK-Si and VIDz-g-SiLK-Si surfaces reaches about 6 and 5 N/cm, respectively. These adhesion strength values were much higher than those of the electrolessly deposited copper on the pristine and Ar plasma-treated SiLK-Si surfaces. The strong adhesion of the electrolessly deposited copper to the VIDz-g-SiLK-Si and 4VP-g- SiLK-Si surfaces was attributed to the synergistic effect of the strong interaction between the pyridine or imidazole functional groups of the grafted polymers with copper atoms, the spatial distribution of the graft chains on the SiLK surface and into the metal matrix, and the fact that the graft chains were covalently tethered on the SiLK surface. (C) 2002 The Electrochemical Society.

Effect of Deposition Conditions for Γ-Aminopropyltriethoxy Silane on Adhesion Between Copper and Epoxy Resins

Effect of Metal Ions on Self Reinforcement of Metal/Adhesive Interphase by Gamma-Aminopropyltriethoxysilane

Controlled Grafting Of Well-Defined Functional Polymers On Hydrogen-Terminated Silicon Substrates: Relevance To Adhesion Of Electrolessly-Deposited Copper

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Understanding the Role of Silane Pretreatments in an Organic Coating System. Part 2: a Study of Molecular Dynamics Simulation

Understanding the Role of Silane Pretreatments in an Organic Coating System. Part 1: Corrosion Performance and Interfacial Property

Silane modification of semi-curing epoxy surface: High interfacial adhesion for conductive coatings

Surface Modification of Copper for Adhesion Promotion by Polybenzimidazole

EFFECT OF SiO2 NANO-PARTICLES ON ADHESION STRENGTH OF COPPER CONDUCTIVE ADHESIVES

Polydopamine/Silane Composite Coating on Electrolytic Copper Foil as Epoxy Adhesion Promoter and Corrosion Inhibitor

Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agents

The Synergistic Effects of Aminosilane Coupling Agent on the Adhesion Performance of Silane Primer for Silicone Resin Thermal Protection Coating

Adhesion Strengths of Epoxy Molding Compounds to Gold-plated Copper Leadframes

The Effect of Pretreatment on Adhesive Strength of Cu-plated Liquid Crystal Polymer (LCP)

Surface Graft Copolymerization Enhanced Adhesion of an Epoxy-Based Printed Circuit Board Substrate (Fr-4) to Copper

Water uptake of epoxy coatings modified with γ-APS silane monomer

Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

Synthesis of Siloxanes Containing Vinyl and Epoxy Group and Its Enhancement for Adhesion of Addition-Cure Silicone Encapsulant

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

Effects of Chain Lengths, Molecular Orientation, and Functional Groups of Thiols Adsorbed Onto CF Surface on Interfacial Properties of CF/epoxy Composites