Polydopamine/Silane Composite Coating on Electrolytic Copper Foil as Epoxy Adhesion Promoter and Corrosion Inhibitor

Mengjun Zhu,Mingtao Gan,Jianfeng Pan,Jiangping Tu,Xiuli Wang,Changdong Gu
DOI: https://doi.org/10.1007/s11664-023-10752-9
IF: 2.1
2023-10-06
Journal of Electronic Materials
Abstract:In order to enhance the electrolytic copper foil-epoxy adhesion in copper clad laminates, surface modification of the copper foil with a proper coupling agent is essential. However, single polydopamine (PDA) or silane coating on the copper foil is usually not satisfied. Herein, a composite coating on the copper foil is proposed by combining the universal adhesion promoter of PDA and the electrodeposited silane layer. X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy confirmed the formation of the composite coating. The composite coating was uniformly distributed on the copper substrate as revealed by nano-infrared spectrometry and scanning electron microscopy observations. Compared with the pristine copper foil, the copper foil modified by the composite coating exhibited increased peel strength to the epoxy substrate by about 42.15% and improved corrosion resistance in both saline water and high-temperature (200°C) environments, which is attributed to its uniformity and the interface compatibility of the composite coating.
engineering, electrical & electronic,materials science, multidisciplinary,physics, applied
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