Abstract:The investigation of interconnection technologies is crucial for advancing semiconductor packaging technology. This study delved into the various methods of achieving electrical interconnections, focusing on the sintering process and composition of the epoxy. Although silver (Ag) has traditionally been utilized in the sintering process, its high cost often precludes widespread commercial applications. Copper (Cu) is a promising alternative that offers advantages, such as cost-effectiveness and high thermal and electrical conductivities. However, the mechanical robustness of the oxide layers formed on Cu surfaces results in several challenges. This research addresses these challenges by integrating epoxy, which has advantages such as adhesive capabilities, chemical resistance, and robust mechanical properties. The chemical reactivity of the epoxy was harnessed to both fortify adhesion and inhibit oxide layer formation. However, the optimal sintering performance required considering both the composite composition (20 wt% epoxy) and the specific sintering conditions (pre-heating at 200 °C and sintering at 250 °C). The experimental findings reveal a balance in the incorporation of epoxy (20 wt%) for the desired electrical and mechanical properties. In particular, the bisphenol A epoxy (Da)-containing sintered Cu chip exhibited the highest lab shear strength (35.9 MPa), whereas the sintered Cu chip without epoxy represented the lowest lab shear strength of 2.7 MPa. Additionally, the introduction of epoxy effectively curtailed the onset of oxidation in the sintered Cu chips, further enhancing their durability. For instance, 30 days after sintering, the percentage of oxygen atoms in the Da-containing sintered Cu chip (4.5%) was significantly lower than that in the sintered Cu chip without epoxy (37.6%), emphasizing the role of epoxy in improving Cu oxidation resistance. Similarly, the samples sintered with bisphenol-based epoxy binders exhibited the highest electrical and thermal conductivities after 1 month. This study provides insights into interactions between epoxy, carboxylic acid, solvents, and Cu during sintering and offers a foundation for refining the sintering conditions.

Studies of copper-catalysed degradation of epoxy coatings and a method for improving the durability of an epoxy/copper interface after thermal aging

Surface Modification of Copper for Adhesion Promotion by Polybenzimidazole

Synthesis of Thermally Degradable Epoxy Adhesives

Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin

Effects of high temperature and high humidity on the reliability of copper/epoxy bond

Clarifying the chemical reactions of the weakening of adhesion between epoxy resin and aluminum by molecular dynamic simulation and experiment

Interfacial Study of Steel Joints Prepared with a Catechol-Modified Epoxy Adhesive with Enhanced Bonding Performance and Durability

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Surface modification for improving interfacial, mechanical and thermal performance characteristics in epoxy composites: Electroless nickel enhancement of dendritic copper particle-reinforced epoxy

Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

A mild and efficient oxidative degradation system of epoxy thermosets: full recovery and degradation mechanism

Examining the early stages of thermal oxidative degradation in epoxy-amine resins

A Study on the Surface Responses and Degradation Mechanisms of Epoxy-Amine Coating Subjected to UV Accelerated Weathering and Hygrothermal Ageing Using ToF-SIMS and FTIR Analysis

Recyclable and Self-Repairable Epoxy Anticorrosion Coatings with Curing-Controlled Thermoplasticity

Adhesion Promotion at High Temperature for Epoxy Resin or Polyimide Onto Metal by a Two‐component Coupling System of Polybenzimidazole and 4‐aminophenyl Disulfide

The Coupling Mechanism of Benzotriazole Pretreated Copper Metal and Epoxy-Resin

Enhancing heat-resistance of epoxy with conductive and crosslink networks by designing imide-based chain extender

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint

Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering

Preparation of Anticorrosive Epoxy Nanocomposite Coating Modified by Polyethyleneimine Nano-Alumina

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging