Adhesion Promotion at High Temperature for Epoxy Resin or Polyimide Onto Metal by a Two‐component Coupling System of Polybenzimidazole and 4‐aminophenyl Disulfide

G XUE,YX WANG,YU CHEN,SS TSAI,LH JIANG
DOI: https://doi.org/10.1002/app.1995.070581210
IF: 3
1995-01-01
Journal of Applied Polymer Science
Abstract:A two-component coupling agent layer consisting of polybenzimidazole and 4-aminophenyl disulfide showed better anticorrosive performance and higher adhesive strength for copper and resins than did each single component even at high temperature. (C) 1995 John Wiley & Sons, Inc.
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