High temperature resistant epoxy adhesive for aeronautical applications

YU Ying-feng,LIU Xiao-yun,LI Shan-jun
DOI: https://doi.org/10.3969/j.issn.1001-5922.2005.05.002
2005-01-01
Abstract:A high temperature resistant, high performance epoxy adhesive was prepared by the modification of epoxy resin with thermoplastics via reaction-induced phase separation. Three kinds of morphologies, particle, bicontinuous, and phase inversion, were observed in the modification systems, and continuous thermoplastic-rich phase structure increased the high temperature properties of adhesive apparently. The morphology and properties are related to the fraction and molecular weight of poly-etherimide.
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