Studies on Phase Separation of Polyesterimide-Modified Epoxy Resin. Ii. Effect of Curing Temperature on Phase Separation and Adhesive Property

Y Luo,H Li,SJ Li
DOI: https://doi.org/10.1081/ma-100105963
2001-01-01
Abstract:A sort of polyesterimide (PEsI) was used as a toughening agent in the modification of epoxy resin/anhydride system. The reaction-induced phase separation in amorphous thermoplastic-modified epoxy system was observed in situ by means of time-resolved light scattering (TRLS) and advanced rheometric expansion system (ARES) at different curing temperature. TRLS displayed that the phase separation of the blend system followed a spinodial decomposition mechanism at different curing temperature. The increase of curing temperature accelerated curing reaction and the increase of the blend viscosity prevented phase separation from proceeding. Results of TRLS and ARES showed that the phase structure fixation was pinned up by blend viscosity at the early stage of curing reaction, rather than by gelification at the late stage of curing reaction. All the experiments, including scanning electron microscopy (SEM), suggested that low curing temperature was beneficial to the formation of longer interdomain distance of the epoxy-in-rich phase in the blend and to the improvement of adhesive property of the blend.
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