6H-SiC blistering efficiency as a function of the hydrogen implantation fluence

N. Daghbouj,B.S. Li,M. Karlik,A. Declemy
DOI: https://doi.org/10.1016/j.apsusc.2018.10.005
IF: 6.7
2019-01-01
Applied Surface Science
Abstract:•The blistering phenomenon by H implantation into 6H-SiC and high-temperature annealing were investigated.•The blistering occurs in a narrow window of ion fluence.•The implantation fluence has strain maximum out-off-plane of approximately 3.4%.
What problem does this paper attempt to address?