Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Liuying Zhao,Huiqiang Liu,Xuechen Chen,Sheng Chu,Han Liu,Zuoye Lin,Qiuguo Li,Guang Chu,Hang Zhang

DOI: https://doi.org/10.1039/c8tc03417f

IF: 6.4

2018-01-01

Journal of Materials Chemistry C

Abstract:Thermal interface material (TIMs) pads/sheets with both high elasticity and low thermal resistance are indispensable components for thermal management.

What problem does this paper attempt to address?

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

Haifei Zhan,Gang Zhang,Xiaoying Zhuang,Rabczuk Timon,Yuantong Gu

DOI: https://doi.org/10.1016/j.carbon.2020.04.065

IF: 10.9

2020-01-01

Carbon

Abstract:To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers have been commonly applied to enhance the thermal conductivity of TIMs, while the enhancement effect has been significantly impeded by the interfacial thermal resistance. This work reveals that the new type of ultra-thin carbon nanomaterial – carbon nanothreads, possess a much smaller interfacial thermal resistance (3.1 ± 0.4 × 10−9 Km2/W) between each other compared with that of the (4,0) carbon nanotubes (8.8 ± 4.6 × 10−9 Km2/W). Similar as found for carbon nanotubes, the interfacial thermal resistance decreases when the interfacial crossing angle decreases or the contact area increases. Surprisingly, both compressive and stretching interfacial distance are found to enhance the interfacial thermal conductance. It is found that different carbon nanothreads exhibit an interfacial thermal conductance between 60 and 110 pW/K, which can be remarkably enhanced by introducing interfacial cross-linkers. Combining with the ultra-thin nature of carbon nanothreads, our work suggests that carbon nanothreads can be an excellent alternative nanofillers for polymer composites with enhanced thermal conductivity.
High performance liquid metal thermal interface materials

Sen Chen,Zhongshan Deng,Jing Liu

DOI: https://doi.org/10.1088/1361-6528/abcbc2

IF: 3.5

2020-12-08

Nanotechnology

Abstract:Abstract Conventional thermal interface materials (TIMs) as widely used in thermal management area is inherently limited by their relatively low thermal conductivity. From an alternative, the newly emerging liquid metal based thermal interface materials (LM-TIMs) open a rather promising way, which can pronouncedly improve the thermal contact resistance and offers tremendous opportunities for making powerful thermal management materials. The LM-TIMs thus prepared exhibits superior thermal conductivity over many conventional TIMs which guarantees its significant application prospect. And the nanoparticles mediated or tuned liquid metal further enable ever conductive LM-TIMs which suggests the ultimate goal of thermal management. In this review, a systematic interpretation on the basic features of LM-TIMs was presented. Representative exploration and progress on LM-TIMs were summarized. Typical approaches toward nanotechnology enhanced high performance LM-TIMs were illustrated. The perspect of this new generation thermal management material were outlined. Some involved challenges were raised. This work is expected to provide a guide line for future research in this field.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Liuying Zhao,Sheng Chu,Xuechen Chen,Guang Chu

DOI: https://doi.org/10.1007/s12034-019-1872-7

IF: 1.878

2019-06-14

Bulletin of Materials Science

Abstract:Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ((kappa )) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of (kappa ) reaching (sim )14.2 (hbox {W mK}^{-1}), greater than that of most of the commercial thermal silicone pads (({sim }5~hbox {W mK}^{-1})). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.

materials science, multidisciplinary
High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Xiao Jia,Bin Liu,Shikun Li,Xunfeng Li,Jingzhi Zhou,Guohui Zhou,Shijun Wang,Min Xu,Cui Xu,Jun Du,Yamin Deng,Xiulan Huai

DOI: https://doi.org/10.1007/s10853-022-07210-y

IF: 4.5

2022-06-04

Journal of Materials Science

Abstract:Incorporating liquid metal droplets into polymer matrix has become one of the most promising strategies to enhance the thermally conductive performance of thermal interface materials (TIMs) for the escalating heat dissipation demands from highly integrated electronic devices. However, most of the TIMs typically choose silicone polymer as the matrix material, which would exhibit silicone oil precipitation and siloxane evaporation after long time utilization. Here, we present a non-silicone TIM with efficient heat dissipation capability by incorporating multi-shaped and proper-sized liquid metal droplets into an epoxy matrix via a combined fabrication approach. This liquid metal epoxy composite (LMEC) exhibits a high thermal conductivity enhanced up to 14 W (nearly 78 increase over the matrix) at 85% volume fraction and an ultra-low thermal resistance of 0.0043 K at 65% volume fraction. Its Kapitza radius and thermal interfacial resistance are estimated from the experimental results, respectively, about 75 nm and K , which helps explaining the reduced thermal conductivity of composites with small droplet inclusions. Moreover, actual cooling tests on a high power heating device demonstrate that 65% LMEC shows superior cooling effects than the non-silicone TIMs of indium foil, pure liquid metal, 85% LMEC, and the silicone oil-based liquid metal composites of 65 and 85% volume fraction, which indicate that not the TIMs with higher intrinsic thermal conductivity would exhibit superior heat dissipation effects, but those possessing low thermal resistance between the heat source and heat sink show better heat transfer properties.

materials science, multidisciplinary
Advanced Thermal Interface Materials for Thermal Management

Wei Yu,Changqing Liu,Lin Qiu,Ping Zhang,Weigang Ma,Yanan Yue,Huaqing Xie,LeighAnn Sarah Larkin

DOI: https://doi.org/10.30919/es8d710

2018-01-01

Engineered Science

Abstract:Thermal interface materials with low thermal contact resistance occupy the development direction, and among these, carbon materials, phase change materials and silver nanopaste demonstrate great potential applications
Silver Nanoparticle-Based Thermal Interface Materials with Ultra-Low Thermal Resistance for Power Electronics Applications

Hui Yu,Liangliang Li,Yujun Zhang

DOI: https://doi.org/10.1016/j.scriptamat.2012.02.037

IF: 6.302

2012-01-01

Scripta Materialia

Abstract:We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

Wenkui Xing,Yue Xu,Chengyi Song,Tao Deng

DOI: https://doi.org/10.3390/nano12193365

IF: 5.3

2022-09-27

Nanomaterials

Abstract:With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

Jianhui Zeng,Ting Liang,Baohao Yang,Taoying Rao,Meng Han,Yimin Yao,Jian-Bin Xu,Liejun Li,Rong Sun

DOI: https://doi.org/10.1021/acsami.4c09914

IF: 9.5

2024-08-22

ACS Applied Materials & Interfaces

Abstract:The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial challenge in meeting reliability standards amidst chip warpage. This particular matter underscores a significant performance bottleneck within...

materials science, multidisciplinary,nanoscience & nanotechnology
Alveoli‐Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High‐Performance Thermal Interface Materials

Sijia Zheng,Haiyan Xue,Ying Liu,Xing Yu,Zhihai Cao

DOI: https://doi.org/10.1002/smll.202306750

IF: 13.3

2023-12-04

Small

Abstract:Inspired by alveoli structure, thermally conductive composites are designed with excellent comprehensive performances. The synergistic effect of the liquid metal and graphite boosts the thermally conductive performance of the composites. Due to the elaborate structure, the designed composites present excellent comprehensive performance, including low density, low Young's modulus, and large‐scale processing capability. Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high‐performance TIM inspired by alveoli is proposed. The material design includes the self‐alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) ‐the alveoli; and a small amount of liquid metal (LM) – capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m−1 K−1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long‐term applications. The thermally conductive, soft, and lightweight composites are believed to be high‐performance silicone bases TIMs for advanced electronics.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
3D printable phase change based thermal interface material with lower total thermal resistance at operating temperature

Lei Hou,Jin-Chao Ji,Gong-Peng Cui,Kai-Yin Sun,Hong-Bo Lan,Mei Chen,Chang-Ping Feng,Fang Wei

DOI: https://doi.org/10.1016/j.est.2024.113303

IF: 9.4

2024-08-19

Journal of Energy Storage

Abstract:Thermal interface materials (TIMs) play a crucial role in addressing the heat dissipation challenges of electronic components, which needing high thermal conductivity and low thermal resistance to effectively improve heat transfer between chip and heat sink. This work focuses on the design of a 3D printable phase change based TIMs, which can be integrated with 3D printing technology to provide shapes suitable for quickly filling the gap between the chip and the heat sink in actual automated production. The optimized sample exhibits a total thermal resistance of 0.0012 m 2 K/W at operating temperature, with a through-plane thermal conductivity of 0.48 W/mK and an in-plane thermal conductivity of 1.24 W/mK. In practical thermal management, the resulting samples demonstrated a temperature reduction of 22 °C comparison with commercial TIM, highlighting its superior heat dissipation capability.

energy & fuels
Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Xulei Wu,Huatao Wang,Ziao Wang,Jinglong Xu,Yajin Wu,Rui Xue,Hongxin Cui,Cong Tian,Yu Wang,Xiaoxiao Huang,Bo Zhong

DOI: https://doi.org/10.1016/j.carbon.2021.06.048

IF: 10.9

2021-09-01

Carbon

Abstract:Thermal interface materials (TIMs) play a crucial role in enhancing the reliability and sustainable utilization of next-generation electronics and thus can help meet the increasing demand for multifunctional devices with higher performance. Herein, we introduce a method for creating a TIM with high cross-plane thermal conductivity based on graphite nanoplatelet (GNP)/polyurethane (PU) films. The graphite nanoplatelets ensured the heat transfer properties of the TIM. Moreover, the hot-pressing procedure improved the thermal conductivity to 26.3 W (m K)-1 with the improved orientation of the GNPs in the PU matrix, as confirmed by microscopy investigation. Under a thermal dissipation power of 10-20 W, a drastic reduction in the chip temperature (17.5-42.3 °C) was achieved using our oriented GNP/PU TIM compared to a commercial silicone TIM (5.0 W (m K)-1). In addition, as-prepared pads can be mass produced at an acceptable cost, indicating that our work provides a promising new approach to fabricating TIMs for application in the next-generation thermal management of high power density electronics.

materials science, multidisciplinary,chemistry, physical
Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions

Xiao Jia,Shijun Wang,Shikun Li,Cui Xu,Jun Du,Jingzhi Zhou,Ziyang Cheng,Feng Zhou,Yamin Deng,Bin Liu,Xiulan Huai

DOI: https://doi.org/10.1016/j.surfin.2023.103335

IF: 6.2

2023-09-08

Surfaces and Interfaces

Abstract:Generally, the function of thermal interface material (TIM) is filling rough surfaces, eradicating air pockets, decreasing thermal resistance, and improving heat dissipating effects. On this basis, we provide the TIM with another identity, "adhesion", rendering it not only play a role of heat dissipation, but also serve as an adhesive to bond contacting surfaces. In this work, nano- to microscopic liquid metal (LM) droplets are embedded into the epoxy matrix to fabricate a LM-epoxy in-situ cured composite. By adding the curing agent, the LM-epoxy composite is cured into an entity structure, transforming from an amorphous grease state to a self-adaptive pad state. When the average droplet size is in a reasonable range of approximately 5–25 μm, the composite's thermal resistance ( R total ) decreases to 2.19 mm 2 K/W at 70% volume fraction with its adhesive strength of 0.497 MPa, and the thermal conductivity ( k TIM ) could increase to 10.05 W/(m·K) at 85%. Both R total and k TIM change rapidly for droplet size approximately ranging from 10 2 nm to 10 1 μm and then tend to level off when it further increases to 10 2 μm. A conception of equivalent contact thickness, δ, is presented to elucidate the contacting thermal resistance R c , and set up predictive models of R total for different volume fractions by considering the microscopic interfacial thermal resistance R b between filler and matrix or not. This composite simultaneously possesses characteristics of the low thermal resistance like thermal grease, the whole entity like thermal pad, and the anti-leak characteristics by in-situ cured process. Actual cooling tests show it has a considerable temperature difference of 4.75 °C lower than the commercial thermal grease at 650 W heating power. This in-situ cured strategy, via decreasing the thermal resistance and solving the problem of LM leakage, remarkably promotes the LM-TIMs achieving a broader application prospect in the future.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
Heat conduction of electrons and phonons in thermal interface materials

Yunshan Zhao,Xiangliang Zeng,Linlin Ren,Xinnian Xia,Xiaoliang Zeng,Jun Zhou

DOI: https://doi.org/10.1039/d0qm01136c

IF: 8.6834

2021-01-01

Materials Chemistry Frontiers

Abstract:Investigation on the thermal transport of heat carriers in TIMs will aid in promoting the advancement of TIMs with high performance.

materials science, multidisciplinary,chemistry
High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

Lin Jing,Rui Cheng,Zexiao Wang,S. Shen,Qixian Wang,Muzzafer Tasoglu,Hannah Zhai

DOI: https://doi.org/10.1002/smll.202207015

IF: 13.3

2023-01-15

Small

Abstract:Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich-structured thermal interface material (TIM) is developed that simultaneously possesses record-low thermal resistance and high flexibility. Frequency-domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom-up fabrication process, excellent contacts between the graphene-coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2 K W-1 . This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics.

Medicine,Engineering,Materials Science
Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Junwei Li,Zhenqiang Ye,Pingjing Mo,Yunsong Pang,Enze Gao,Chenxu Zhang,Guoping Du,Rong Sun,Xiaoliang Zeng

DOI: https://doi.org/10.1016/j.compscitech.2023.109948

IF: 9.1

2023-02-06

Composites Science and Technology

Abstract:With the ever-shrinking characteristic dimension of chips and the increasing of packaging density, heat dissipation has become the most critical technology challenge for electronic devices. The development of high-performance thermal interface materials (TIMs) for enhancing thermal coupling and minimizing thermal resistance between heterogeneous components is the key to achieving efficient thermal management of electronic devices. Herein, we report a high-performance carbon fiber/polydimethylsiloxane (CF/PDMS) TIM based on the construction of vertically oriented carbon fiber arrays and the modulation of PDMS's crosslinking density. The resulting CF/PDMS TIM exhibits highly desirable characteristics of through-plane thermal conductivity up to 43.47 W/m∙K (only 20 vol% loading), outstanding elastic compliance similar to soft biological tissues (stress ∼ 35 kPa at 35% compressive strain), and excellent resilience performance (resilience rate of 85% after compression cycles). In addition, the heat dissipation capability of CF/PDMS TIM is improved further by forming interconnected heat-conducting structures on the CF/PDMS TIM's surface. The optimal CF/PDMS TIM in microprocessor cooling application exhibits superior heat dissipation capability and stability during 1000 power cycles, resulting in a 68 °C reduction in the chip temperature compared with the state-of-the-art commercial TIM. This work opens up a new avenue for fabricating high-performance TIMs that meet the heat dissipation requirements of high-performance computing.

materials science, composites
Silver-based Thermal Interface Materials with Low Thermal Resistance

Hui Yu,Rui Zhang,Liangliang Li,Xiaofei Mao,Hongda Du

DOI: https://doi.org/10.1109/icept-hdp.2012.6474646

2012-01-01

Abstract:We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.
Improvement of interfacial thermal resistance between TIMs and copper for better thermal management

Xiaoyu Fan,Ying Sun,Leyi Huang,Jiaqiu Xie,Xiaoliang Zeng,Chenhan Liu,Lifa Zhang,Yunshan Zhao

DOI: https://doi.org/10.1016/j.surfin.2024.103905

IF: 6.2

2024-01-26

Surfaces and Interfaces

Abstract:Due to the increasing power consumption of modern electronic devices and rapid rise in heat generation, how to efficiently manage the heat dissipation becomes a challenge. The previous studies have shown the importance of interface treatment for better thermal management while the mechanism is lacking yet. Here, we study the interface thermal transport between the thermal interface materials (TIMs) and the copper substrate using both experimental measurements and theoretical calculations. The results show that after interface treatment, the thermal contact resistance between the graphite materials and copper decreases from 87.96 K · mm 2 · W −1 to 20.26 K · mm 2 · W −1 . For the practical testing, a difference up to 7 ○ C is demonstrated between the treated and untreated samples, indicating the potential of reduction of thermal contact resistance for the heat dissipation in electronic devices, which is verified in our theoretical calculation as well. Our study provides an applicable approach to enhancing the thermal stability in electronic devices by investigating the impact of the interfacial thermal resistance on heat dissipation.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Xu-Dong Zhang,Zi-Tong Zhang,Hong-Zhang Wang,Bing-Yang Cao

DOI: https://doi.org/10.1021/acsami.2c20713

2023-01-07

Abstract:Thermal interface materials (TIMs), as typical thermal functional materials, are highly required to possess both high thermal conductivity and low Young's modulus. However, the naturally synchronized change in the thermal and mechanical properties seriously hinders the development of high-performance TIMs. To tackle such a dilemma, a strategy of codoping solid fillers and liquid metal fillers into polymer substrates is proposed in this study. This strategy includes a large amount of liquid...

materials science, multidisciplinary,nanoscience & nanotechnology
Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Kun Huang,Songfeng Pei,Qinwei Wei,Qing Zhang,Jiaqi Guo,Chaoqun Ma,Hui-Ming Cheng,Wencai Ren

DOI: https://doi.org/10.1021/acsnano.4c06952

IF: 17.1

2024-08-18

ACS Nano

Abstract:Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal...

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
Recent advances in polymer-based thermal interface materials for thermal management: A mini-review

Chang-Ping Feng,Lu-Yao Yang,Jie Yang,Lu Bai,Rui-Ying Bao,Zheng-Ying Liu,Ming-Bo Yang,Hong-Bo Lan,Wei Yang

DOI: https://doi.org/10.1016/j.coco.2020.100528

IF: 8

2020-12-01

Composites Communications

Abstract:With the development of high frequency and high integration of electronics such as 5G technology, overheating problem becomes an increasingly challenging problem. To address this pressing issue, the designs and innovations of high-performance polymer-based thermal interface materials (TIMs) with excellent heat dissipation ability are urgently demanded. This review summarizes the physical fundamentals, typical types and current status of polymer-based TIMs. We put emphases on the practical application requirement of TIMs, and the strategies for enhancing through-plane thermal conductivity and reducing thermal contact resistance. Perspectives on further research are provided, which will be beneficial to further understand the working mechanisms, advanced processing strategies and practical applications of polymer-based TIMs.

materials science, composites

Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

High performance liquid metal thermal interface materials

Efficient heat conducting liquid metal/CNT pads with thermal interface materials

High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Advanced Thermal Interface Materials for Thermal Management

Silver Nanoparticle-Based Thermal Interface Materials with Ultra-Low Thermal Resistance for Power Electronics Applications

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

Alveoli‐Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High‐Performance Thermal Interface Materials

3D printable phase change based thermal interface material with lower total thermal resistance at operating temperature

Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions

Heat conduction of electrons and phonons in thermal interface materials

High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Silver-based Thermal Interface Materials with Low Thermal Resistance

Improvement of interfacial thermal resistance between TIMs and copper for better thermal management

Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Recent advances in polymer-based thermal interface materials for thermal management: A mini-review