What problem does this paper attempt to address?

### Problems Addressed by the Paper This paper primarily explores the thermal conduction behavior of electrons and phonons in thermal interface materials (TIMs) and proposes methods to improve the overall thermal conductivity of TIMs. Specifically: 1. **Background and Challenges**: - As electronic devices trend towards miniaturization, high integration, and high power density, heat dissipation has become a critical issue affecting their performance and reliability. - Especially, the high power density of 5G devices demands better thermal conductivity materials for efficient heat dissipation. 2. **Role of Thermal Interface Materials**: - TIMs are used to fill the gaps between heat sinks and chips to maximize the heat transfer capability between their contact surfaces. - Typical TIMs consist of a polymer matrix and inorganic fillers, with their overall thermal conductivity depending on the thermal conductivity of the polymer and fillers, as well as the interfacial thermal resistance (ITR) between them. 3. **Research Focus**: - The paper focuses on the interactions between the polymer matrix and fillers and the thermal conduction network they form. - It also introduces new thermal measurement techniques to measure interfacial thermal resistance and points out that reducing interfacial thermal resistance helps achieve higher thermal conductivity in TIMs. 4. **Exploration of Microscopic Mechanisms**: - Current research on TIMs mainly focuses on macroscopic preparation methods and material thermal conductivity, lacking exploration of TIMs design and thermal conduction mechanisms from the microscopic perspective of electrons and phonons. - To better understand the thermal conduction mechanisms and provide experimental and theoretical guidance for designing high-performance TIMs, it is necessary to review the thermal conduction behavior of electrons and phonons in TIMs. 5. **Specific Strategies**: - Several specific strategies to improve the thermal conduction of TIMs are proposed, including enhancing the bonding strength between fillers and polymers and constructing thermal conduction paths between fillers. - By surface functionalization and forming covalent bonds, phonon scattering at the interface can be reduced, thereby improving thermal conductivity. In summary, this paper aims to propose effective methods to improve the thermal conductivity of TIMs by deeply studying the thermal conduction mechanisms of electrons and phonons in TIMs, providing guidance for the design of high-performance thermal interface materials.

Heat conduction of electrons and phonons in thermal interface materials

Perspective of Computing Thermal Transport in Low-Dimensional Materials and Nanostructures

Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials

Interface Phonon Scattering Suppression Boosts Heat Conduction in Thermal Interface Materials

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

A Unified Phonon Interpretation for the Non-Fourier Heat Conduction by Non-equilibrium Molecular Dynamics Simulations

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review

Inelastic Phonon Transport Across Atomically Sharp Metal/semiconductor Interfaces

Methodology Perspective Of Computing Thermal Transport In Low-Dimensional Materials And Nanostructures: The Old And The New

Impact of Electron-Phonon Interaction on Thermal Transport: A Review

Interface Phonon Transport in Nanomaterials: Numerical Methods and Modulation Strategies

Heat Conduction Behavior of Two-Dimensional Nanomaterials and Their Interface Regulation

Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Improvement of interfacial thermal resistance between TIMs and copper for better thermal management

Present and future thermal interface materials for electronic devices

Ab initio investigations on hydrodynamic phonon transport: From diffusion to convection

2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

High performance liquid metal thermal interface materials

Direct observation of large electron–phonon interaction effect on phonon heat transport

Thermal Transports in the MXenes Family: Opportunities and Challenges

Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal Conductivity