Advanced Thermal Interface Materials for Thermal Management

Wei Yu,Changqing Liu,Lin Qiu,Ping Zhang,Weigang Ma,Yanan Yue,Huaqing Xie,LeighAnn Sarah Larkin

DOI: https://doi.org/10.30919/es8d710

2018-01-01

Engineered Science

Abstract:Thermal interface materials with low thermal contact resistance occupy the development direction, and among these, carbon materials, phase change materials and silver nanopaste demonstrate great potential applications

What problem does this paper attempt to address?

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

Haifei Zhan,Gang Zhang,Xiaoying Zhuang,Rabczuk Timon,Yuantong Gu

DOI: https://doi.org/10.1016/j.carbon.2020.04.065

IF: 10.9

2020-01-01

Carbon

Abstract:To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers have been commonly applied to enhance the thermal conductivity of TIMs, while the enhancement effect has been significantly impeded by the interfacial thermal resistance. This work reveals that the new type of ultra-thin carbon nanomaterial – carbon nanothreads, possess a much smaller interfacial thermal resistance (3.1 ± 0.4 × 10−9 Km2/W) between each other compared with that of the (4,0) carbon nanotubes (8.8 ± 4.6 × 10−9 Km2/W). Similar as found for carbon nanotubes, the interfacial thermal resistance decreases when the interfacial crossing angle decreases or the contact area increases. Surprisingly, both compressive and stretching interfacial distance are found to enhance the interfacial thermal conductance. It is found that different carbon nanothreads exhibit an interfacial thermal conductance between 60 and 110 pW/K, which can be remarkably enhanced by introducing interfacial cross-linkers. Combining with the ultra-thin nature of carbon nanothreads, our work suggests that carbon nanothreads can be an excellent alternative nanofillers for polymer composites with enhanced thermal conductivity.
Enhanced thermal conductivity and reduced thermal resistance in carbon fiber-based thermal interface materials with vertically aligned structure

Zhenbang Zhang,Rongjie Yang,Yandong Wang,Kang Xu,Wen Dai,Jianxiang Zhang,Maohua Li,Linhong Li,Yingying Guo,Yue Qin,Boda Zhu,Yiwei Zhou,Xingye Wang,Tao Cai,Cheng-Te Lin,Kazuhito Nishimura,Hao Nan Li,Nan Jiang,Jinhong Yu

DOI: https://doi.org/10.1039/d4ta03924f

IF: 11.9

2024-01-01

Journal of Materials Chemistry A

Abstract:A sandwich-structured thermal interface material featuring vertically aligned carbon fibers and liquid metal-modified layers for enhanced thermal conductivity and reduced contact resistance in electronic devices.

materials science, multidisciplinary,chemistry, physical,energy & fuels
Research Progress Of Advanced Thermal Management Materials

He Peng,Geng Hui-Yuan

DOI: https://doi.org/10.11868/j.issn.1001-4381.2017.001194

2018-01-01

Journal of Materials Engineering

Abstract:Thermal management systems, controlling the dispersion, storage and conversion of heat, were widely used in various fields of national economy and defence applications etc. Advanced thermal management materials form the material basis of the thermal management system, while the thermal conductivity was the critical property of all the thermal management materials. The application, classification, and physical mechanism of heat conduction of advanced thermal management materials were reviewed in this paper. The research progress and existing problems of thermal interface materials, high thermal conductivity packaging materials, thermal storage materials and thermoelectric materials were introduced. It is pointed out that molecular dynamics, density functional theory and large-scale parallel computing technology will play increasingly import roles in revealing the multi-scale heat transfer mechanism in the homogeneous and composite materials.
Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Liuying Zhao,Huiqiang Liu,Xuechen Chen,Sheng Chu,Han Liu,Zuoye Lin,Qiuguo Li,Guang Chu,Hang Zhang

DOI: https://doi.org/10.1039/c8tc03417f

IF: 6.4

2018-01-01

Journal of Materials Chemistry C

Abstract:Thermal interface material (TIMs) pads/sheets with both high elasticity and low thermal resistance are indispensable components for thermal management.
Silver-based Thermal Interface Materials with Low Thermal Resistance

Hui Yu,Rui Zhang,Liangliang Li,Xiaofei Mao,Hongda Du

DOI: https://doi.org/10.1109/icept-hdp.2012.6474646

2012-01-01

Abstract:We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.
High performance liquid metal thermal interface materials

Sen Chen,Zhongshan Deng,Jing Liu

DOI: https://doi.org/10.1088/1361-6528/abcbc2

IF: 3.5

2020-12-08

Nanotechnology

Abstract:Abstract Conventional thermal interface materials (TIMs) as widely used in thermal management area is inherently limited by their relatively low thermal conductivity. From an alternative, the newly emerging liquid metal based thermal interface materials (LM-TIMs) open a rather promising way, which can pronouncedly improve the thermal contact resistance and offers tremendous opportunities for making powerful thermal management materials. The LM-TIMs thus prepared exhibits superior thermal conductivity over many conventional TIMs which guarantees its significant application prospect. And the nanoparticles mediated or tuned liquid metal further enable ever conductive LM-TIMs which suggests the ultimate goal of thermal management. In this review, a systematic interpretation on the basic features of LM-TIMs was presented. Representative exploration and progress on LM-TIMs were summarized. Typical approaches toward nanotechnology enhanced high performance LM-TIMs were illustrated. The perspect of this new generation thermal management material were outlined. Some involved challenges were raised. This work is expected to provide a guide line for future research in this field.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Advances of CNT-based Systems in Thermal Management

Yu Wei,Liu Changhong,Fan Shoushan

DOI: https://doi.org/10.1007/s12274-020-3255-1

IF: 9.9

2021-01-01

Nano Research

Abstract:Effective thermal management has become extremely urgent for electronics due to the massive heat originated from the ever-rising power density. With the merits of high thermal conductivity, good chemical stability and desirable mechanical properties, carbon nanotubes (CNTs) are considered to have great potential to be widely used in heat dissipation devices. This article describes the progress on thermal conductivity of CNT-reinforced composites, aligned CNT materials (aligned CNT arrays, films/buckypapers and fibers) as high thermal conductors, experimental and theoretical results of CNT-substrate interface resistance, and utilizations of CNTs in the passive heat dissipation (natural convection, heat radiation, and phase-change heat transfer). Finally, the challenges and prospects are discussed to provide some hints in the future studies. It is believed that CNTs can play an important role in thermal management of electronics, especially in the portable electronic devices.
Silver Nanoparticle-Based Thermal Interface Materials with Ultra-Low Thermal Resistance for Power Electronics Applications

Hui Yu,Liangliang Li,Yujun Zhang

DOI: https://doi.org/10.1016/j.scriptamat.2012.02.037

IF: 6.302

2012-01-01

Scripta Materialia

Abstract:We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Organic Phase Change Materials Confined in Carbon-Based Materials for Thermal Properties Enhancement: Recent Advancement and Challenges

Xuan Tong,Nianqi Li,Min Zeng,Qiuwang Wang

DOI: https://doi.org/10.1016/j.rser.2019.03.031

IF: 16.799

2019-01-01

Renewable and Sustainable Energy Reviews

Abstract:Phase change materials used in thermal energy storage systems are critical for energy utilization. Organic phase change materials have received considerable attention both for applications and research due to their favorable properties, such as large latent heat, low cost, stability, nontoxicity, and corrosion resistance. Because of the inherently low thermal conductivity, there has been a lot of research on various combinations of organic phase change materials with high conductivity materials. Carbon nanotubes, graphene and porous carbon have excellent properties, such as ultrahigh surface area and high thermal conductivity, which have become the preferred materials for thermal properties enhancement. Benefit from the varied dimensional spaces for retaining materials, these carbon-based materials can act as excellent confinement for phase change materials to form shape stabilized, phase change tunable, and thermally enhanced phase change composites. In this paper, a review about recent advancement and challenges for organic phase change materials confined in different types of carbon-based materials is presented, associated with some relevant theories trying to understand the mechanism of heat transfer and phase change in micro/ nano confinement. Some promising applications in thermal management and energy conversion that have great potential for more explorations are also introduced.
High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

Lin Jing,Rui Cheng,Zexiao Wang,S. Shen,Qixian Wang,Muzzafer Tasoglu,Hannah Zhai

DOI: https://doi.org/10.1002/smll.202207015

IF: 13.3

2023-01-15

Small

Abstract:Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich-structured thermal interface material (TIM) is developed that simultaneously possesses record-low thermal resistance and high flexibility. Frequency-domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom-up fabrication process, excellent contacts between the graphene-coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2 K W-1 . This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics.

Medicine,Engineering,Materials Science
Controllable Construction of CNT-Interconnected Liquid Metal Networks for Thermal Management

Gang Zhou,Lei Yao,Zuoxiang Xie,Urooj Kamran,Junwen Xie,Fei Zhang,Soo-Jin Park,Yinhang Zhang

DOI: https://doi.org/10.1016/j.compositesa.2023.107743

2023-08-18

Abstract:Multifunctional portable devices for thermal management are crucial due to the development of small microelectronic devices. Traditional polymer composite-based materials have limitations such as single functionality, high costs, and low fire resistance. In this study, a multifunctional liquid metal (LM)-interconnected carbon nanotube (CNT)/aramid nanofiber (ANF) film was fabricated via facile vacuum-assisted self-assembly approach, followed by compression. ANFs serve as interfacial binders between LM and CNTs via hydrogen bonding, while LM interconnects the adjacent CNT layers for fast thermal transport of phonons and electrons. The resulting composite films exhibited high bidirectional thermal conductivity (in-plane: 4.6 W/mK, through-plane: 1.1 W/mK), providing reliable cooling. Moreover, the as-fabricated films demonstrated excellent flame retardancy (20 s of burning), impressive Joule heating performance (200 °C at 3.5 V), and effective electromagnetic interference shielding (53 dB). This work provides an efficient method for fabricating multifunctional thermal management materials for microelectronic devices, battery thermal management, and artificial intelligence.

materials science, composites,engineering, manufacturing
Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

Ying Zhou,Qingshuo Wei,Minfang Zhang,Hideaki Nakajima,Toshiya Okazaki,Takeo Yamada,Kenji Hata

DOI: https://doi.org/10.1021/acsami.3c15704

IF: 9.5

2023-12-20

ACS Applied Materials & Interfaces

Abstract:Carbon nanotubes (CNTs) stand out for their exceptional electrical, thermal, and mechanical attributes, making them highly promising materials for cutting-edge, lightweight, and flexible thermoelectric applications. However, realizing the full potential of advanced thermoelectric CNTs requires precise management of their electrical and thermal characteristics. This study, through interface optimization, demonstrates the feasibility of reducing the thermal conductivity while preserving robust...

materials science, multidisciplinary,nanoscience & nanotechnology
Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)

Zilong Xie,Zhengli Dou,Die Wu,Xiangtong Zeng,Yuan Feng,Yunfei Tian,Qiang Fu,Kai Wu

DOI: https://doi.org/10.1002/adfm.202370082

IF: 19

2023-04-06

Advanced Functional Materials

Abstract:Contact Thermal Resistance In article number 2214071, Kai Wu, Qiang Fu, and co‐workers report a joint‐inspired interfacial engineering strategy by employing liquid metal to the surface of rigid alumina, which improves material's thermal conductivity and thixotropy. This method will inspire development of high‐performance polymer‐based thermal interface materials for future advanced electronics.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Carbon Nanotube‐Derived Materials for Smart Thermal Management

Ling Liu,Xiaona Wang,Hehua Jin,Jin Wang,Qingwen Li

DOI: https://doi.org/10.1002/adsu.202400757

IF: 6.737

2024-12-01

Advanced Sustainable Systems

Abstract:Thermal management employs high thermal conductivity and efficient insulation, integrating active and passive heating. Carbon nanotubes (CNTs) are highlighted for their lightweight, robust attributes and superior conductivities, playing a significant role in intelligent thermal systems. This review emphasizes CNTs' potential in enhancing thermal efficiency, insulation, and energy conversion, providing strategic insights for developing advanced thermal management solutions. Thermal management involves precisely controlling temperatures in systems, devices, or electronic products to ensure optimal performance, stability, enhanced efficiency, and lifespan, which include high thermal conductivity, superthermal insulation, and active and passive heating. Carbon nanotubes (CNTs), known for their low density, high mechanical strength, and superior thermal and electrical conductivities, represent ideal materials for lightweight, high‐strength applications, showcasing extensive benefits and potential in intelligent thermal management. This review explores the use of CNTs in improving thermal conductivity, insulation, photothermal conversion, and electrical heating, underscoring their unique advantages and broad application prospects in smart thermal management systems. Specifically, the article outlines the advantages of CNT materials in elevating thermal efficiency, enhancing insulation characteristics, and increasing energy conversion rates, offering vital scientific and technical guidance for creating innovative, next‐generation thermal management materials. By systematically analyzing and forecasting, this review provides strategic direction for the research and development of high‐performance thermal management materials, heralding the significant role of CNT materials in future studies.

materials science, multidisciplinary,green & sustainable science & technology
Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials

Jiashuo Sheng,Zhian Zhang,Yunsong Pang,Xiaxia Cheng,Chen Zeng,Jian-Bin Xu,Leicong Zhang,Xiaoliang Zeng,Linlin Ren,Rong Sun

DOI: https://doi.org/10.1021/acsami.4c13118

IF: 9.5

2024-10-30

ACS Applied Materials & Interfaces

Abstract:In recent years, adhesive thermal interface materials have attracted much attention because of their reliable adhesion properties on most substrates, preventing moisture, vibration impact, or chemical corrosion damage to components and equipment, as well as solving the heat dissipation problem. However, thermal interface materials have a huge contradiction between strong adhesion and high thermal conductivity. Here, we report a polymer-based thermal interface material consisting of...

materials science, multidisciplinary,nanoscience & nanotechnology
Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material

Changqing Liu,Haiping Xu,Jiawei Yang,Huaqing Xie,Wei Yu

DOI: https://doi.org/10.1016/j.ijthermalsci.2022.107679

IF: 4.779

2022-09-01

International Journal of Thermal Sciences

Abstract:The adjustable thermal conductivity and thermal contact resistance are the key ways to realize efficient thermal management of electronic devices. In this work, a low melting-point alloy/paraffin/olefin block copolymer thermal interface material with the above properties was designed and prepared. Low melting-point alloy and paraffin undergo phase transformation with the increase of temperature, resulting in the significant decrease of thermal contact resistance. Moreover, the liquid phase low melting-point alloy particles are connected to reconstruct an efficient heat conduction path, which enhances the thermal conductivity of composites. In addition, this paper studied the thermal conductivity of composites at two different temperatures (30 °C/50 °C) and the effect of temperature or pressure on the thermal contact resistance. Furthermore, the heat dissipation effect of composites was evaluated by infrared thermal imager. The results prove that the thermal conductivity of composites (90 wt% filler) increases from 0.99 W/m⋅Kto 1.87 W/m⋅Kas the temperature increases from 30 °C to 50 °C. The thermal contact resistance of composites (90 wt% filler) is reduced to 0.024 K⋅cm2/W(60 °C, 40 Psi). Moreover, the results of heat dissipation experiments also confirm that the thermal contact resistance decreases with the enhancement of temperature. Therefore, all the results indicate that the thermal conductivity and thermal contact resistance of composites can be adjusted by changing the temperature.

engineering, mechanical,thermodynamics
Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Kun Huang,Songfeng Pei,Qinwei Wei,Qing Zhang,Jiaqi Guo,Chaoqun Ma,Hui-Ming Cheng,Wencai Ren

DOI: https://doi.org/10.1021/acsnano.4c06952

IF: 17.1

2024-08-18

ACS Nano

Abstract:Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal...

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
Recent development on heat transfer and various applications of phase-change materials

Liu Yang,Xing Jin,Yuan Zhang,Kai Du

DOI: https://doi.org/10.1016/j.jclepro.2020.124432

IF: 11.1

2021-03-01

Journal of Cleaner Production

Abstract:<p>Thermal energy storage and phase change materials (PCMs) have become one of the most important research subjects in recent years. The present paper first introduces the generalities including the properties, advantages and disadvantages of various PCMs. Then the heat transfer modeling and enhancement techniques of Melting and freezing process of PCMs are summarized. Afterwards the application of PCMs in solar, electrical, thermal management, construction, textile, food, and pharmaceutical systems are reviewed. Finally, the challenges and prospects in research and applications of PCMs are presented. Previous studies show that use of PCMs has great potential to reduce energy consumption in various applications leading to the reduction of carbon dioxide emissions and environmental pollution. Organic PCMs have been widely used and proposed by various researchers due to their better stability and recycling. Using nanoparticles improves the PCMs' performance and the thermal conductivity of PCMs and phase change time depends on the shape of the nanoparticles and increases with nanoparticle concentration. Some challenges such as high cost, the destructive effect of nanoparticles and PCMs on the human body and the environment, and the durability of PCMs after long-term use should be considered in the future researches.</p>

environmental sciences,green & sustainable science & technology,engineering, environmental
High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management

Juncheng Xia,Xiangdong Kong,Linhong Li,Zhenbang Zhang,Yapeng Chen,Maohua Li,Yue Qin,Tao Cai,Wen Dai,Shuangquan Fang,Jian Yi,Cheng-Te Lin,Kazuhito Nishimura,Nan Jiang,Jinhong Yu

DOI: https://doi.org/10.1021/acsami.3c16602

IF: 9.5

2024-02-03

ACS Applied Materials & Interfaces

Abstract:The implementation of passive cooling strategies is crucial for transitioning from the current high-power- and energy-intensive thermal management practices to more environmentally friendly and carbon-neutral alternatives. Among the various approaches, developing thermal management materials with high thermal conductivity and emissivity for effective cooling of personal and wearable devices in both indoor and outdoor settings poses significant challenges. In this study, we successfully...

materials science, multidisciplinary,nanoscience & nanotechnology
Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

Wenkui Xing,Yue Xu,Chengyi Song,Tao Deng

DOI: https://doi.org/10.3390/nano12193365

IF: 5.3

2022-09-27

Nanomaterials

Abstract:With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry

Advanced Thermal Interface Materials for Thermal Management

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

Enhanced thermal conductivity and reduced thermal resistance in carbon fiber-based thermal interface materials with vertically aligned structure

Research Progress Of Advanced Thermal Management Materials

Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Silver-based Thermal Interface Materials with Low Thermal Resistance

High performance liquid metal thermal interface materials

Advances of CNT-based Systems in Thermal Management

Silver Nanoparticle-Based Thermal Interface Materials with Ultra-Low Thermal Resistance for Power Electronics Applications

Organic Phase Change Materials Confined in Carbon-Based Materials for Thermal Properties Enhancement: Recent Advancement and Challenges

High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

Controllable Construction of CNT-Interconnected Liquid Metal Networks for Thermal Management

Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)

Carbon Nanotube‐Derived Materials for Smart Thermal Management

Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials

Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material

Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Recent development on heat transfer and various applications of phase-change materials

High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics