Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials

Jiashuo Sheng,Zhian Zhang,Yunsong Pang,Xiaxia Cheng,Chen Zeng,Jian-Bin Xu,Leicong Zhang,Xiaoliang Zeng,Linlin Ren,Rong Sun
DOI: https://doi.org/10.1021/acsami.4c13118
IF: 9.5
2024-10-30
ACS Applied Materials & Interfaces
Abstract:In recent years, adhesive thermal interface materials have attracted much attention because of their reliable adhesion properties on most substrates, preventing moisture, vibration impact, or chemical corrosion damage to components and equipment, as well as solving the heat dissipation problem. However, thermal interface materials have a huge contradiction between strong adhesion and high thermal conductivity. Here, we report a polymer-based thermal interface material consisting of...
materials science, multidisciplinary,nanoscience & nanotechnology
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