Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance

Zhengli Dou,Bin Zhang,Pengfei Xu,Qiang Fu,Kai Wu
DOI: https://doi.org/10.1021/acsami.3c13298
IF: 9.5
2023-11-30
ACS Applied Materials & Interfaces
Abstract:Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (R(eff)) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc...
materials science, multidisciplinary,nanoscience & nanotechnology
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