Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

Jianhui Zeng,Ting Liang,Baohao Yang,Taoying Rao,Meng Han,Yimin Yao,Jian-Bin Xu,Liejun Li,Rong Sun
DOI: https://doi.org/10.1021/acsami.4c09914
IF: 9.5
2024-08-22
ACS Applied Materials & Interfaces
Abstract:The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial challenge in meeting reliability standards amidst chip warpage. This particular matter underscores a significant performance bottleneck within...
materials science, multidisciplinary,nanoscience & nanotechnology
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