Abstract:Generally, the function of thermal interface material (TIM) is filling rough surfaces, eradicating air pockets, decreasing thermal resistance, and improving heat dissipating effects. On this basis, we provide the TIM with another identity, "adhesion", rendering it not only play a role of heat dissipation, but also serve as an adhesive to bond contacting surfaces. In this work, nano- to microscopic liquid metal (LM) droplets are embedded into the epoxy matrix to fabricate a LM-epoxy in-situ cured composite. By adding the curing agent, the LM-epoxy composite is cured into an entity structure, transforming from an amorphous grease state to a self-adaptive pad state. When the average droplet size is in a reasonable range of approximately 5–25 μm, the composite's thermal resistance ( R total ) decreases to 2.19 mm 2 K/W at 70% volume fraction with its adhesive strength of 0.497 MPa, and the thermal conductivity ( k TIM ) could increase to 10.05 W/(m·K) at 85%. Both R total and k TIM change rapidly for droplet size approximately ranging from 10 2 nm to 10 1 μm and then tend to level off when it further increases to 10 2 μm. A conception of equivalent contact thickness, δ, is presented to elucidate the contacting thermal resistance R c , and set up predictive models of R total for different volume fractions by considering the microscopic interfacial thermal resistance R b between filler and matrix or not. This composite simultaneously possesses characteristics of the low thermal resistance like thermal grease, the whole entity like thermal pad, and the anti-leak characteristics by in-situ cured process. Actual cooling tests show it has a considerable temperature difference of 4.75 °C lower than the commercial thermal grease at 650 W heating power. This in-situ cured strategy, via decreasing the thermal resistance and solving the problem of LM leakage, remarkably promotes the LM-TIMs achieving a broader application prospect in the future.

Silver Nanoparticle-Based Thermal Interface Materials with Ultra-Low Thermal Resistance for Power Electronics Applications

Silver-based Thermal Interface Materials with Low Thermal Resistance

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

Liquid Metal Nano/micro-Channels As Thermal Interface Materials for Efficient Energy Saving

Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Advanced Thermal Interface Materials for Thermal Management

Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design

Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles

Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material

Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications

Thermal interface material with graphene enhanced sintered copper for high temperature power electronics

High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

Improvement of interfacial thermal resistance between TIMs and copper for better thermal management

Thermal resistance analysis of Sn-Bi solder paste used as thermal interface material for power electronics applications

High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions

Research progress on solder thermal interface materials

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials