Abstract:With the rapid development of various chips towards high performance and integration, the 'thermal barrier' difficulty facing electronic devices has become ever increasingly challenging, while at the same time the space size left for thermal management system already becomes much narrower. In view of the intermittent operation or short-time large power consumption of some electronic devices, the thermal management technology based on phase change materials (PCMs) has received more and more attention. Among those cutting edge PCMs, the liquid metal phase change materials (LMPCMs) especially have aroused much interest due to their outstanding merits in thermal conductivity, energy storage density and stability. In this article, the representative works on LMPCMs are comprehensively reviewed. First, the thermophysical parameters of LMPCMs characterized by high thermal conductivity and large density are summarized. Then, some basic research cases on the thermophysical properties of metallic PCMs that are worthy of further investigation are briefly introduced. In view of the serious supercooling problem of the LMPCMs, the factors affecting the supercooling degree of liquid metal (LM), particularly the thermal history effect, based on the nucleation theory, are presented. Strategies for suppressing supercooling using nucleating agents and crystal species as well as external fields are also introduced. In addition, the mathematical models and related numerical algorithms for interpreting the phase change heat transfer mechanisms of LM are illustrated. Finally, the performance advantages of LMPCMs over other PCMs, as well as the technical approaches to further improve various properties of LMPCM heat sinks, are demonstrated by showing typical application cases. Based on the above, the current research status of LMPCMs and promising future research hotspots are prospected.This review is expected to help researchers interested in LMPCMs to quickly grasp the performance, heat transfer evaluation methods, and research status of LMPCMs, and also to provide a guidance for engineers in related fields to conduct further design and practices.

Experimental Investigation on Optimization of the Performance of Gallium-Based Liquid Metal with High Thermal Conductivity As Thermal Interface Material for Efficient Electronic Cooling

Excellent Thermal Performance of Gallium-Based Liquid Metal Alloy As Thermal Interface Material Between Aluminum Substrates

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Liquid Metal Hydrothermal Rheological Modification Method for High Performance Gallium‐Coated Carbon Microparticle Composites

Transient Performance of a Thermal Energy Storage-Based Heat Sink Using a Liquid Metal As the Phase Change Material

Investigation on the Optimized Binary and Ternary Gallium Alloy As Thermal Interface Materials

Construction and the Performance of the Combination Heat Transfer Mode of Dots-and-Plane Based on Liquid Metal and AlN

Reverse Nonequilibrium Molecular Dynamics Simulation for Thermal Conductivity of Gallium-Based Liquid Metal

Minimizing Interface Thermal Resistance Via Laser Surface Micropatterning for Enhancing Wetting of Gallium-Based Liquid Metal with Copper

High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Thermal Property Enhancement Of Liquid Metal Used As Thermal Interface Material By Mixing Magnetic Particles

High performance liquid metal thermal interface materials

Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure

Wettability and thermal contact resistance of thermal interface material composited by gallium-based liquid metal on copper foam

Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability

Enhanced Thermal Performance and Stability of Non-Gallium Liquid Metal Composites

On the effective thermal conductivity of gallium-based liquid metal filled elastomers

Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy

Enhanced interface heat transfer based on gallium-based liquid metal infiltrated into vertically aligned copper nanowire arrays

Experimental Study on Flow and Heat-Transfer Characteristics of Ga-In-Sn Alloy in a Round Tube Applied for High Heat Flux Device Cooling

Liquid metal phase change materials for thermal management of electronics