Minimizing Interface Thermal Resistance Via Laser Surface Micropatterning for Enhancing Wetting of Gallium-Based Liquid Metal with Copper

Xinyu Hu,Ze Tian,Changhao Chen,Guochen Jiang,Lizhong Wang,Rui Peng,Daizhou Li,Hongjun Zhang,Peixun Fan,Minlin Zhong
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2023.124424
2023-01-01
Abstract:Thermal management systems are facing significant demand to dissipate increasing heat fluxes in time, however, heat transfer between solid surfaces is always obstructed due to the unperfect interfacial con-tact. Gallium-based room-temperature liquid metals (LM) are a type of emerging thermal interface ma-terials (TIMs) with superior thermal conductivity and deformability, efficiently enhancing the through -interface thermal transfer. However, the poor wettability of LMs with engineering materials (e.g., copper), which leads to non-negligible remaining gap/air at the interfaces, limits the further reduction of thermal interface resistance. Herein, a laser micropatterning approach is presented to significantly improve LM wetting behaviors with copper surfaces in the assistance of HCl solution, with the thermal interface re-sistance minimized to & SIM;0.37 mm2 & BULL;K/W which is four orders of magnitudes lower than that of two bare surfaces directly contacted and a quarter of that of bare surfaces with LM as TIM. Micropatterns featuring dense, shallow and open channels were designed and demonstrated to effectively expel trapped air while using a small amount of LM, which were both found necessary for reducing thermal interface resistance. We believe this study can lay a foundation for the further development and practical application of LMs based thermal management strategies.& COPY; 2023 Elsevier Ltd. All rights reserved.
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