Abstract:Effective thermal conduction between solid interfaces has emerged as a major bottleneck in heat dissipating heat from new-generation high-performance electronics. Gallium-based liquid metals (LMs), known for their high thermal conductivity, are gaining significant traction as thermal interface materials (TIMs) for enhanced thermal management. In this work, to address the key issues facing the application of gallium-based LMs as TIMs, including the lack of composition ratio data, poor coating performance and the need for improved thermal conductivity, two types of gallium-based LM-TIMs (Ga-In binary LM-TIMs and Ga-In-Sn ternary LM-TIMs) with different composition ratios were experimentally prepared, investigated and optimized. The thermal conductivities of the LM-TIMs at different temperatures (80 - 120 ℃) were tested, and the application reliability of the LM-TIMs was optimized by continuously destructing the oxide layer and filling micro copper particles. The influence of optimization parameters such as the duration of the destruction of oxide layer, the filling ratios of the particles and the particle size on the operation performance of the LM-TIMs was studied and analyzed. The results showed that the LM-TIMs exhibited excellent thermal conductivities of 29.6 - 38.5 W/(m·K), and the thermal conductivity increased with indium mass fraction and decreased with tin mass fraction. Significant improvements in coating performance were observed with the increase of the duration of destructing oxide layer, but it led to a reduction in thermal conductivity. Balancing coating performance and thermal conductivity, it was found that 30 min was the ideal duration. The filling of micro particles made up for the reduced thermal conductivity, and higher filling ratios and smaller particle sizes achieved better enhancement. In the experiment, a filling ratio of 5 % was appropriate because solidification occurred in LM-TIMs at higher filling ratios which weakened the thermal conductivity. This work provided valuable reference for the application and optimization of high thermal conductive gallium-based LM-TIMs.

Enhanced interface heat transfer based on gallium-based liquid metal infiltrated into vertically aligned copper nanowire arrays

Experimental Investigation on Optimization of the Performance of Gallium-Based Liquid Metal with High Thermal Conductivity As Thermal Interface Material for Efficient Electronic Cooling

Thermal Property Enhancement Of Liquid Metal Used As Thermal Interface Material By Mixing Magnetic Particles

Wettability and thermal contact resistance of thermal interface material composited by gallium-based liquid metal on copper foam

Construction and the Performance of the Combination Heat Transfer Mode of Dots-and-Plane Based on Liquid Metal and AlN

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure

Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Excellent Thermal Performance of Gallium-Based Liquid Metal Alloy As Thermal Interface Material Between Aluminum Substrates

High performance liquid metal thermal interface materials

High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability

Investigation on the Optimized Binary and Ternary Gallium Alloy As Thermal Interface Materials

Investigation on Carbon Nanotubes As Thermal Interface Material Bonded with Liquid Metal Alloy

Minimizing Interface Thermal Resistance Via Laser Surface Micropatterning for Enhancing Wetting of Gallium-Based Liquid Metal with Copper

Indium Assisted Multiwalled Carbon Nanotube Array Thermal Interface Materials

Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials

Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Effect of Metal Buffer Layer on the Thermal Interface Performance of Liquid Metal Alloy on Copper Plate

Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites

Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays