Silver-based Thermal Interface Materials with Low Thermal Resistance

Hui Yu,Rui Zhang,Liangliang Li,Xiaofei Mao,Hongda Du
DOI: https://doi.org/10.1109/icept-hdp.2012.6474646
2012-01-01
Abstract:We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.
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